Multi-pair differential lines printed circuit board common mode filter

Patent metadata

Field	Value
Publication number	US-9544991-B2
Application number	US-201113977537-A
Country	US
Kind code	B2
Filing date	Dec 19, 2011
Priority date	Dec 19, 2011
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

Multi-pair differential lines printed circuit board common mode filters are generally described. In one embodiment, the apparatus includes a multi-layer printed circuit board, a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board, a second differential pair on the first layer of the printed circuit board, and a common mode filter on a second layer of the printed circuit board, the common mode filter comprising an absence of a predominantly occurring dielectric material of the printed circuit board, the common mode filter spanning an area directly below at least a portion of both the first and the second differential pairs. Other embodiments are also described and claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a multi-layer printed circuit board including a first dielectric material, wherein the first dielectric material is a most predominant of any dielectric materials of the multi-layer printed circuit board;
a first signal line and a second signal line forming a first differential pair on a first layer of the printed circuit board;
a second differential pair on the first layer of the printed circuit board; and
a common mode filter on a second layer of the printed circuit board, wherein all of the first dielectric material is external to the common mode filter, wherein the common mode filter extends directly below a portion of the first differential pair and further extends directly below portion of the second differential pair.

2. The apparatus of claim 1 , wherein the common mode filter comprises a void on the second layer directly below an area between the first differential pair and the second differential pair.

3. The apparatus of claim 1 , wherein the common mode filter comprises a magnetic lossy material.

4. The apparatus of claim 1 , wherein the common mode filter comprises a conductive lossy material.

5. The apparatus of claim 1 , further comprising a third differential pair on the first layer of the printed circuit board above the common mode filter, the third differential pair adjacent to the first differential pair and the second differential pair.

6. The apparatus of claim 1 , wherein the first layer of the printed circuit board comprises a surface level.

7. The apparatus of claim 6 , wherein the common mode filter comprises dielectric material extending up to the surface level in an area between the first differential pair and the second differential pair.

8. The apparatus of claim 1 , wherein the second layer of the printed circuit board comprises a power plane.

9. An apparatus comprising:
an integrated circuit device on a multi-layer printed circuit board including a first dielectric material, wherein the first dielectric material is a most predominant of any dielectric materials of the multi-layer printed circuit board;
a first differential pair coupled with the integrated circuit device, the differential pair on a first layer of the printed circuit board;
a second differential pair coupled with the integrated circuit device, the second differential pair substantially parallel to the first differential pair on the first layer of the printed circuit board; and
a common mode filter on a second layer of the printed circuit board, wherein all of the first dielectric material is external to the common mode filter, wherein the common mode filter extends directly below a portion of the first differential pair and further extends directly below a portion of the second differential pair.

10. The apparatus of claim 9 , wherein the common mode filter further comprises a void on the second layer directly below an area between the first differential pair and the second differential pair.

11. The apparatus of claim 9 , wherein the common mode filter comprises a magnetic lossy material.

12. The apparatus of claim 9 , wherein the common mode filter comprises a conductive lossy material.

13. The apparatus of claim 9 , wherein the common mode filter further comprises dielectric material extending up to the first layer of the printed circuit board in an area between the first differential pair and the second differential pair.

14. The apparatus of claim 9 , wherein the second layer of the printed circuit board comprises a ground plane.

Assignees

• Chen Chung-Hao J
• Han Dong-Ho
• Schaffer Mike
• Intel Corp

Inventors

• Chen Chung-Hao J
• Han Dong-Ho
• Schaffer Mike

Classifications

• G06F1/16

  Constructional details or arrangements · CPC title

• H01P1/20327

  Electromagnetic interstage coupling · CPC title

• H05K1/0237 Primary

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H01F17/0013

  with stacked layers · CPC title

• H01F2017/0093

  Common mode choke coil · CPC title