Boiling refrigerant type cooling system

Patent metadata

Field	Value
Publication number	US-9544988-B2
Application number	US-201414551499-A
Country	US
Kind code	B2
Filing date	Nov 24, 2014
Priority date	Jun 13, 2011
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

First claim

What is claimed is:

1. A boiling refrigerant type cooling system comprising:
a heat reception jacket, attached to a heat generating body provided on a circuit board, that vaporizes a liquid contained inside by heat from the heat generating body;
a condenser that receives steam from the heat reception jacket and transmits heat to the outside so as to condense the steam to the liquid;
a first pipe that conducts the steam from the heat reception jacket to the condenser; and
a second pipe that conducts the liquid from the condenser to the heat reception jacket,
wherein the heat reception jacket comprises a boiling heat transfer unit which contacts the liquid and is in thermal contact with the heat generating body, and
wherein the boiling heat transfer unit comprises:
a plurality of parallel tunnels under a surface, wherein the plurality of parallel tunnels communicate with the outside via gaps,
a groove formed through the plurality of parallel tunnels, wherein the groove is closer than the plurality of parallel tunnels to the heat generating body, and
a cover plate on the groove.

2. The boiling refrigerant type cooling system according to claim 1 , wherein the groove is configured to be formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

3. The boiling refrigerant type cooling system according to claim 2 ,
wherein the groove is configured to be formed through middle of the boiling heat transfer unit.

4. A boiling refrigerant type cooling system comprising:
a heat reception jacket, attached to a heat generating body provided on a circuit board, which vaporizes a liquid contained inside by heat from the heat generating body;
wherein the heat reception jacket comprises a boiling heat transfer unit in thermal contact with the heat generating body, and
wherein the boiling heat transfer unit comprises:
a plurality of parallel tunnels, wherein the parallel tunnels communicate with the outside via gaps,
a groove formed through the plurality of parallel tunnels, wherein the groove is closer than the plurality of parallel tunnels to the heat generating body, and
a cover plate on the groove.

5. The boiling refrigerant type cooling system according to claim 4 , wherein the groove is configured to be formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

6. A boiling refrigerant type cooling system comprising:
a heat reception jacket, attached to a heat generating body provided on a circuit board, which vaporizes a liquid contained inside by heat from the heat generating body;
wherein the heat reception jacket comprises a boiling heat transfer unit in thermal contact with the heat generating body, and
wherein the boiling heat transfer unit comprises:
a plurality of parallel tunnels, wherein the parallel tunnels communicate with the outside via gaps,
a groove formed through the plurality of parallel tunnels, and
a cover plate on the groove.

7. The boiling refrigerant type cooling system according to claim 6 , wherein the groove is formed through the plurality of parallel tunnels in an orthogonal direction to the plurality of parallel tunnels.

Assignees

• Hitachi Ltd

Inventors

• Suzuki Kazuaki
• Sato Shigemasa
• Idei Akio

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• F25B39/04

  Condensers · CPC title

• F28D15/046

  characterised by the material or the construction of the capillary structure · CPC title

• H05K7/20318

  Condensers · CPC title

• H05K1/0201 Primary

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title