Optoelectronic packages having through-channels for routing and vacuum

Patent metadata

Field	Value
Publication number	US-9543735-B2
Application number	US-201514697768-A
Country	US
Kind code	B2
Filing date	Apr 28, 2015
Priority date	Sep 26, 2014
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A stacked optoelectronic packaged device includes a plurality of stacked components within a package material having a package body providing side walls and a bottom wall for the package, and a lid which seals a top of the package. The stacked components include a first cavity die having a top surface and a bottom surface including at least one through-channel formed in the bottom surface. A bottom die has a top surface including at least one electrical trace and a light source die thereon. At least one of the through-channels of the first cavity die are aligned to the electrical trace, and the first cavity die is bonded to the bottom die with the electrical trace being within the through-channel and not contacting the first cavity die to provide a vacuum sealing structure. A photodetector (PD) is optically coupled to receive the light originating from the light source.

First claim

The invention claimed is:

1. A stacked optoelectronic packaged device, comprising:
a plurality of stacked components within a package comprising a package material having a package body providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
a first cavity die having a cavity, a top surface and a bottom surface including at least one through-channel formed in said bottom surface, each through channel extending from the cavity to an outer edge of the first cavity die;
a bottom die having a top surface including thereon at least one electrical trace and a light source die for emitting light coupled to said electrical trace, wherein the light source is within the cavity and the at least one electrical trace extends on said top surface of the bottom die from a bond pad within the cavity to a bond pad outside of the outer edge of the first cavity die;
wherein at least one of said through-channels of said first cavity die is aligned to said electrical trace;
wherein said first cavity die is bonded to said bottom die;
wherein said electrical trace is within said through-channel and not contacting said first cavity die to provide, with an epoxy, an inner vacuum sealing structure, and

a photodetector (PD) die optically coupled to receive said light originating from said light source die.

2. The stacked optoelectronic packaged device of claim 1 , wherein said at least one electrical trace comprises a first plurality of said electrical traces and said at least one of said through-channels comprises a second plurality of said through-channels, wherein all of said first plurality of said electrical traces are collectively within said second plurality of said through-channels.

3. The stacked optoelectronic packaged device of claim 1 , further comprising a heater on said top surface of said bottom die.

4. The stacked optoelectronic packaged device of claim 1 , wherein a height of said through-channel is at least 2 μm greater than a thickness of said electrical trace and a minimum width of said through-channel throughout a thickness of said electrical trace is at least 20 μm greater than a width of said electrical trace.

5. The stacked optoelectronic packaged device of claim 1 , further comprising an optics die on said first cavity die and a sealing die on said optics die.

6. The stacked optoelectronic packaged device of claim 1 , wherein said first cavity die comprises glass.

7. The stacked optoelectronic packaged device of claim 1 , wherein said first cavity die comprises silicon.

8. The stacked optoelectronic packaged device of claim 1 , wherein said PD die is mounted on a base portion of an inner package that is inside said package, wherein said inner package has an open top opposite said base portion that faces said bottom wall of said package.

9. A stacked optoelectronic packaged device, comprising:
a plurality of stacked components within a package comprising a package material having a package body providing side walls and a bottom wall for said package, and a lid for sealing a top of said package, said plurality of stacked components including:
a first cavity die having a cavity, a top surface, and a bottom surface including a through-channel formed in said bottom surface, the through-channel extending from the cavity to an outer edge of the first cavity die;
a bottom die having a top surface including thereon an electrical trace and a light source die for emitting light coupled to said electrical trace, wherein the electrical trace extends on the top surface of the bottom die from a bond pad within the cavity to a bond pad outside of the outer edge of the first cavity die;
wherein said through-channels of said first cavity die is aligned to said electrical trace;
wherein said first cavity die is bonded to said bottom die;
wherein said electrical trace is within said through-channel and not contacting said first cavity die,
an optics die on said first cavity die;
a sealing die on said optics die
a second cavity die on said sealing die, and

a photodetector (PD) die optically coupled to receive said light originating from said light source die.

10. A method of forming a packaged stacked optoelectronic device, comprising:
positioning a bottom die on a bottom wall of a package comprising a package material having a package body providing side walls and said bottom wall, said bottom die having a top surface including an electrical trace and a light source die for emitting light thereon;
positioning a first cavity die having a cavity, a top surface and a bottom surface including a through-channel formed in said bottom surface on said top surface of said bottom die so that said through-channel is aligned to said electrical trace, the electrical trace extending on the top surface of the bottom die from a bond pad within the cavity to a bond pad outside of a perimeter of the first cavity die;
bonding said first cavity die to said bottom die, wherein said electrical trace is within said through-channel and not contacting said first cavity die;
positioning a photodetector (PD) die in a location to be coupled to receive said light originating from said light source die;
creating a vacuum within said package, and
sealing a lid on a top of said side walls for sealing said package under said vacuum.

11. The method of claim 10 , further comprising positioning an optics die on said first cavity die, and a sealing die on said optics die.

12. The method of claim 10 , wherein said PD die is mounted on a base portion of an inner package that is inside said package, said inner package having an open top opposite said base portion that faces said bottom wall of said package.

13. The method of claim 10 , wherein a height of said through-channel is at least 2 μm greater than a thickness of said electrical trace and a width of said through-channel throughout a thickness of said electrical trace is at least 20 μm greater than a width of said electrical trace.

14. The method of claim 10 , wherein said first cavity die comprises glass.

15. The method of claim 10 , wherein said first cavity die comprises silicon, further comprising self-terminated wet etching to form said through-channel formed in said bottom surface of said first cavity die.

16. The method of claim 10 , wherein said electrical trace further comprises a heater on said top surface of said bottom die.

17. The method of claim 10 , wherein said electrical trace comprises a first plurality of said electrical traces and said through-channels comprises a second plurality of said through-channels, and all of said first plurality of said electrical traces are collectively within said second plurality of said through-channels.

Assignees

• Texas Instruments Inc

Inventors

• Parsa Roozbeh
• French William

Classifications

• H10W72/07254

  changes in dispositions · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/247

  Dispositions of multiple bumps · CPC title