Electron multiplier

Patent metadata

Field	Value
Publication number	US-9543129-B2
Application number	US-201214123250-A
Country	US
Kind code	B2
Filing date	May 31, 2012
Priority date	Jun 2, 2011
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

An electron multiplier includes an insulating substrate which includes an electrical wiring pattern and in which a through-hole is formed, an MCP arranged on one side of the through-hole of the insulating substrate and electrically connected to the electrical wiring pattern, a shield plate arranged in one side of the MCP and electrically connected to the MCP, an anode arranged on the other side of the through-hole and electrically connected to the electrical wiring pattern, and a signal readout terminal fixed to the insulating substrate for reading a signal from the anode. The shield plate is formed to include the MCP when viewed in a thickness direction. A through-hole exposing at least a portion of the MCP is formed in the shield plate. The insulating substrate, the MCP, the shield plate and the anode are fixed to each other to be integral.

First claim

The invention claimed is:

1. An electron multiplier comprising:
an insulating substrate which includes an electrical wiring pattern and in which a through-hole extending in a thickness direction is formed, wherein the electrical wiring pattern includes a first electrical wiring pattern provided on a first surface of the insulating substrate and a second electrical wiring pattern provided on a back surface of the insulating substrate;
a micro-channel plate arranged on the insulating substrate on one side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern, wherein the first electrical wiring pattern includes a micro-channel plate connection that is formed around the through-hole of the insulating substrate on the first surface side and electrically connected to the micro-channel plate;
a metal plate arranged on one side of the micro-channel plate in the thickness direction and electrically connected to the micro-channel plate;
an anode arranged on the insulating substrate on the other side of a through-hole of the insulating substrate in the thickness direction and electrically connected to the electrical wiring pattern, wherein the second electrical wiring pattern is electrically connected to the anode; and
a signal readout terminal provided on and fixed to the insulating substrate for reading a signal from the anode through the electrical wiring pattern, wherein
the metal plate is formed to include the micro-channel plate when viewed in the thickness direction, and a through-hole exposing at least a portion of the micro-channel plate is formed in the metal plate,
the insulating substrate, the micro-channel plate, the metal plate and the anode are fixed to each other to be integral,
the second electrical wiring pattern includes a capacitor and is electrically connected to the signal readout terminal,
the metal plate is fixed directly to the insulating substrate by a fastening member, and
the micro-channel plate is interposed between the insulating substrate and the metal plate and fixed to the insulating substrate and the metal plate.

2. The electron multiplier according to claim 1 , wherein: in the electrical wiring pattern, an output side of the micro-channel plate is connected to a voltage supply terminal which is electrically connected to the other side of the micro-channel plate through a first bleeder circuit unit.

3. The electron multiplier according to claim 2 , wherein, in the electrical wiring pattern, a second bleeder circuit unit having a smaller resistance value than resistance value of the micro-channel plate is connected to be in parallel with the micro-channel plate.

4. The electron multiplier according to claim 1 , wherein a voltage to be supplied to one side of the micro-channel plate is applied to the metal plate.

5. The electron multiplier according to claim 1 , wherein the metal plate is formed to include the insulating substrate when viewed in the thickness direction.

6. The electron multiplier according to claim 1 , wherein the micro-channel plate is interposed between the insulating substrate and the metal plate and fixed to the insulating substrate and the metal plate.

7. The electron multiplier according to claim 1 , wherein the metal plate is fixed to the insulating substrate by a conductive fastening member and electrically connected to the electrical wiring pattern.

8. The electron multiplier according to claim 1 , wherein the anode is fixed to the insulating substrate by a conductive bonding agent and electrically connected to the electrical wiring pattern.

9. The electron multiplier according to claim 1 , wherein a fixing hole for fixation to the outside is provided in at least one of the insulating substrate and the metal plate.

10. The electron multiplier according to claim 1 , wherein:
the insulating substrate is a refractive substrate which at least includes a first parallel portion extending in parallel with the metal plate, a second parallel portion arranged to be stacked on the other side of the first parallel portion in the thickness direction, and an intersecting portion which intersects the first and second parallel portions to connect the first and second parallel portions,
the through-hole of the insulating substrate is formed in the first parallel portion,
the anode is provided on a surface of the first parallel portion on the second parallel portion side, and
a post having an insulating property or conductive property is interposed between the first and second parallel portions.

11. The electron multiplier according to claim 1 , wherein:
the insulating substrate at least includes a first substrate and a second substrate arranged to be stacked on the other side of the first substrate in the thickness direction,
the through-hole of the insulating substrate is formed in the first substrate,
the anode is provided on a surface of the first substrate on the second substrate side, and
a post having an insulating property or conductive property is interposed between the first and second substrates.

12. The electron multiplier according to claim 1 , wherein:
the insulating substrate is a multi-substrate which at least includes a first substrate and a second substrate arranged to be stacked on the other side of the first substrate in the thickness direction,
the through-hole of the insulating substrate is formed in the first substrate, and
the anode is provided on the surface of the second substrate on the first substrate side.

13. The electron multiplier according to claim 12 , wherein a noise shield portion is formed on a surface of the second substrate on the side opposite to the first substrate.

Assignees

• Suzuki Akio
• YANAGIHARA Yuto
• Kobayashi Hiroshi
• Hamamatsu Photonics Kk

Inventors

• Suzuki Akio
• YANAGIHARA Yuto
• Kobayashi Hiroshi

Classifications

• H01J43/28

  Vessels {, e.g. wall of the tube}; Windows; Screens; Suppressing undesired discharges or currents · CPC title

• H01J43/246 Primary

  Microchannel plates [MCP] (image amplification tubes using MCP H01J31/507) · CPC title

• H01J43/04 Primary

  Electron multipliers {(if forming part of electron gun H01J3/023)} · CPC title