Collimator for use in substrate processing chambers

Patent metadata

Field	Value
Publication number	US-9543126-B2
Application number	US-201514607273-A
Country	US
Kind code	B2
Filing date	Jan 28, 2015
Priority date	Nov 26, 2014
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

Embodiments of collimators for use in substrate processing chambers are provided herein. In some embodiments, a collimator includes: a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions; a first plurality of apertures in the central region having a first aspect ratio; a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region.

First claim

The invention claimed is:

1. A collimator for use in a substrate processing chamber, comprising:
a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions;
a first plurality of apertures in the central region having a first aspect ratio;
a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and
a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region,
wherein the central region has a circular edge formed by the transitional region.

2. The collimator of claim 1 , wherein the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures are textured.

3. The collimator of claim 1 , wherein the third plurality of apertures are cut at a predetermined angle of 15 to 45 degrees.

4. The collimator of claim 1 , wherein the first plurality of apertures includes 61 apertures.

5. The collimator of claim 1 , wherein upper portions of the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures include a chamfer.

6. The collimator of claim 5 , wherein the chamfer is about 2.5° and has a length of about 1 inch.

7. The collimator of claim 5 , wherein the chamfer is about 15° and has a length of about 0.15 inches.

8. The collimator of claim 1 , wherein an aspect ratio of the first plurality of apertures is 3.3:1.

9. The collimator of claim 1 , wherein each of the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures is hexagonal.

10. The collimator of claim 1 , wherein a circle circumscribing each of the first plurality of apertures has a diameter of about 1.5 inches.

11. A collimator for use in a substrate processing chamber, comprising:
a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions;
a first plurality of apertures in the central region having a first aspect ratio;
a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and
a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region,
wherein the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures are textured,
wherein upper portions of the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures include a chamfer, and
wherein the central region has a circular edge formed by the transitional region.

12. The collimator of claim 11 , wherein the third plurality of apertures are cut at a predetermined angle of 15 to 45 degrees.

13. The collimator of claim 11 , wherein the first plurality of apertures includes 61 apertures.

14. The collimator of claim 11 , wherein the chamfer is about 2.5° and has a length of about 1 inch.

15. The collimator of claim 11 , wherein the chamfer is about 15° and has a length of about 0.15 inches.

16. The collimator of claim 11 , wherein an aspect ratio of the first plurality of apertures is 3.3:1.

17. The collimator of claim 11 , wherein each of the first plurality of apertures, the second plurality of apertures, and the third plurality of apertures is hexagonal.

18. The collimator of claim 11 , wherein a circle circumscribing each of the first plurality of apertures has a diameter of about 1.5 inches.

19. A substrate processing chamber, comprising:
a chamber body defining an inner volume;
a sputtering target disposed in an upper portion of the inner volume;
a substrate support disposed below the sputtering target; and
a collimator disposed in the inner volume between the sputtering target and the substrate support, wherein the collimator comprises:
a body having a central region, a peripheral region, and a transitional region disposed between the central and peripheral regions;
a first plurality of apertures in the central region having a first aspect ratio;
a second plurality of apertures in the peripheral region having a second aspect ratio less than the first aspect ratio; and
a third plurality of apertures in the transitional region, wherein the third plurality of apertures are cut so the transitional region forms a conical shape surrounding the central region,
wherein the central region has a circular edge formed by the transitional region.

20. The substrate processing chamber of claim 19 , wherein an aspect ratio of the first plurality of apertures is 3.3:1.

Assignees

• Applied Materials Inc

Inventors

• Riker Martin Lee

Classifications

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• C23C14/35

  by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} · CPC title

• H01J37/3408

  Planar magnetron sputtering · CPC title

• H01J37/34 Primary

  operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) · CPC title

• C23C14/046 Primary

  Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates · CPC title