Adhesive composition and adhesive tape

Patent metadata

Field	Value
Publication number	US-9540550-B2
Application number	US-201214431815-A
Country	US
Kind code	B2
Filing date	Sep 29, 2012
Priority date	Sep 29, 2012
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

The present invention provides a thermally conductive adhesive composition, based on the total weight of the composition, comprising: (a) 5-70% by weight of an epoxy component; (b) 5-60% by weight of thermally conductive material; (c) 0.001-10% by weight of a photoinitiator; (d) 0-40% by weight of a thermoplastic polymer; (e) 0-50% by weight of a hydroxyl-functional component; and (f) 0-50% by weight of a halogen-free flame retardant. The present invention further provides a thermally conductive adhesive tape comprising the adhesive composition.

First claim

We claim:

1. A thermally conductive adhesive composition, based on the total weight of the composition, comprising:
(a) 15-45% by weight of an epoxy component;
(b) 20-40% by weight of electrically insulating, thermally conductive material;
(c) 0.5-4% by weight of a photoinitiator;
(d) 5-25% by weight of a thermoplastic polymer;
(e) 1-5% by weight of a hydroxyl-functional component; and
(f) 1-25% by weight of a halogen-free flame retardant.

2. The adhesive composition of claim 1 , wherein the epoxy component comprises one or more epoxy resins and/or monomers.

3. The adhesive composition of claim 1 , wherein the thermally conductive material is one or more selected from ceramics, metal oxides, metal nitrides, metal hydroxides, BN, SiC, AlN, Al 2 O 3 , Si 3 N 4 .

4. The adhesive composition of claim 1 , wherein the thermally conductive material has a thermal conductivity of 100 W/m·k or more.

5. The adhesive composition of claim 3 , wherein the metal hydroxides are selected from a group consisting of aluminum hydroxide, alkali metal hydroxides and alkaline earth metal hydroxides.

6. The thermally conductive adhesive composition of claim 1 , wherein the photoinitiator is one or more selected from photoinitiators including α-amino ketones group, photoinitiators including benzyl ketals group, photoinitiators including benzophenones group, aryl iodonium salts type photoinitiators, aryl sulfonium salts type photoinitiators, alkyl sulfonium salts type photoinitiators, iron aromatic salt type photoinitiators, and acylation sulfonylurea oxygen radical ketones.

7. The adhesive composition of claim 1 , wherein the photoinitiator comprises a mixture of triarylsulfonium hexafluorophosphate salts.

8. The adhesive composition of claim 1 , wherein the thermoplastic polymer comprises one of an ethylene vinyl acetate copolymer component, an acrylic polymer resin, or an epoxy modified acrylic polymer resin.

9. The adhesive composition of claim 8 , wherein the ethylene vinyl acetate copolymer component comprises one or more kinds of ethylene vinyl acetate copolymers.

10. The adhesive composition of claim 1 , wherein the hydroxyl-functional component comprises one or more hydroxyl-containing compounds having a hydroxyl functionality of at least one.

11. The adhesive composition of claim 1 , wherein the halogen-free flame retardant is selected from a group consisting of metal oxides, hydrous metal compounds, phosphorus containing compounds, ammonium polyphosphates, metal borates and graphite materials.

12. The thermally conductive adhesive composition of claim 1 , further comprising 0-5% by weight of an additive, wherein the additive is one or more selected from tackifiers, antioxidants, coupling agents, thickeners, auxiliary flame retardant agents, antifoaming agents, pigments, surfactants, and surface-modifiers.

Assignees

• 3M Innovative Properties Co

Inventors

• Wu Qing
• Li Zhou
• Qin Liang
• Kong Fanwang
• Wan Hongmei

Classifications

• C09J163/00 Primary

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• Y10T428/1476

  Release layer · CPC title

• Y10T428/287

  including epoxy group or epoxy polymer · CPC title

• C09J7/0207

  Chemistry & Metallurgy · mapped topic

• C08K2201/001

  Conductive additives · CPC title