Anisotropic conductive film and semiconductor device bonded by the same

Patent metadata

Field	Value
Publication number	US-9540549-B2
Application number	US-201213718104-A
Country	US
Kind code	B2
Filing date	Dec 18, 2012
Priority date	Dec 19, 2011
Publication date	Jan 10, 2017
Grant date	Jan 10, 2017

Abstract

A semiconductor device bonded by an anisotropic conductive film and an anisotropic conductive film composition, the anisotropic conductive film including a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq; a hydrogenated epoxy resin; and a sulfonium cation curing catalyst.

First claim

What is claimed is:

1. A display device bonded by an anisotropic conductive film, the anisotropic conductive film comprising:
about 1 to about 20 parts by weight of a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;
about 5 to about 50 parts by weight of a hydrogenated epoxy resin; and
about 0.1 to about 10 parts by weight of a sulfonium cation thermal curing catalyst, all parts by weight being based on 100 parts by weight of the anisotropic conductive film in terms of solid content,
wherein the anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.

2. The display device as claimed in claim 1 , wherein the anisotropic conductive film further includes a binder resin and conductive particles.

3. The display device as claimed in claim 2 , wherein the binder resin includes at least one selected from the group of a polyimide resin, a polyamide resin, a phenoxy resin, an epoxy resin, a polymethacrylate resin, a polyacrylate resin, a polyurethane resin, an acrylate modified urethane resin, a polyester resin, a polyester urethane resin, a polyvinyl butyral resin, a styrene-butylene-styrene resin and epoxy modifications thereof, a styrene-ethylene-butylene-styrene resin and modifications thereof, and acrylonitrile butadiene rubber and hydrogenated compounds thereof.

4. The display device according as claimed in claim 1 , wherein the hydrogenated epoxy resin has an epoxy equivalent weight of about 150 to about 1,300 g/eq.

5. The display device according as claimed in claim 1 , wherein the hydrogenated epoxy resin includes a hydrogenated bisphenol A epoxy resin.

6. The display device as claimed in claim 5 , wherein the hydrogenated bisphenol A epoxy resin includes at least one selected from the group of a hydrogenated bisphenol A epoxy monomer represented by Formula 2, below, or a hydrogenated bisphenol A epoxy oligomer represented by Formula 3, below,

wherein, in Formula 3, n is an integer of about 1 to about 13.

7. The display device as claimed in claim 1 , wherein the reactive monomer includes at least one selected from the group of a reactive monomer having at least two glycidyl groups, a reactive monomer having a monoaromatic structure, and a reactive monomer having an alicyclic structure.

8. The display device as claimed in claim 7 , wherein the reactive monomer includes at least one selected from the group of resorcinol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, dicyclopentadiene dioxide, 2-((4-(2-oxiranylmethoxy)phenoxy)methyl)oxirane, diglycidyl 1,2-cyclohexanedicarboxylate, diglycidyl terephthalate, and diglycidyl o-phthalate.

9. The display device as claimed in claim 1 , wherein the sulfonium cation thermal curing catalyst includes sulfonium borate.

10. The display device as claimed in claim 9 , wherein the sulfonium borate includes a compound represented by Formula 1:

wherein:
R 1 is selected from the group of hydrogen, a methyl group, an ethyl group,

 R 4 being selected from the group of an aromatic hydrocarbon, a substituted aromatic hydrocarbon, an aliphatic hydrocarbon, a substituted aliphatic hydrocarbon, a carboxyl group, and a sulfonyl group;
R 2 is selected from the group of toluene, phenol, benzene, o-xylene, and substituted or unsubstituted naphthalene;
R 3 is selected from the group of a methyl group, an ethyl group, a propyl group, and a butyl group; and
X is fluorine.

11. The display device as claimed in claim 10 , wherein R 2 is methylnaphthalene or dimethylnaphthalene.

12. A display device bonded by a rapid low-temperature curable anisotropic conductive film, the rapid low-temperature curable anisotropic conductive film comprising:
about 1 to about 20 parts by weight of a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq,
about 5 to about 50 parts by weight of a hydrogenated epoxy resin;
about 5 to about 50 parts by weight of a sulfonium cation thermal curing catalyst;
about 20 to about 60 parts by weight of a binder resin; and
about 0.1 to about 30 parts by weight of conductive particles, all parts by weight being based on 100 parts by weight of the rapid low-temperature curable anisotropic conductive film in terms of solid content,
wherein the rapid low-temperature curable anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.

13. The display device as claimed in claim 12 , wherein the reactive monomer includes at least one selected from the group of a reactive monomer having at least two glycidyl groups, a reactive monomer having a monoaromatic structure, and a reactive monomer having an alicyclic structure.

14. The display device as claimed in claim 12 , wherein the reactive monomer includes at least one selected from the group of resorcinol diglycidyl ether, 1,4-cyclohexane dimethanol diglycidyl ether, dicyclopentadiene dioxide, 2-((4-(2-oxiranylmethoxy)phenoxy)methyl)oxirane, diglycidyl 1,2-cyclohexanedicarboxylate, diglycidyl terephthalate, and diglycidyl o-phthalate.

15. A display device bonded by an anisotropic conductive film, the anisotropic conductive film comprising:
about 1 to about 20 parts by weight of a reactive monomer having an epoxy equivalent weight of about 120 to about 180 g/eq;
about 5 to about 50 parts by weight of a hydrogenated bisphenol A epoxy resin; and
about 0.1 to about 10 parts by weight of a sulfonium cation curing catalyst, all parts by weight being based on 100 parts by weight of the anisotropic conductive film in terms of solid content,
wherein the anisotropic conductive film has a curing rate of about 80% or more when cured at 150 to 170° C. for 5 seconds.

16. The display device as claimed in claim 15 , wherein the hydrogenated bisphenol A epoxy resin includes at least one selected from the group of a hydrogenated bisphenol A epoxy monomer represented by Formula 2, below, or a hydrogenated bisphenol A epoxy oligomer represented by Formula 3, below,

wherein, in Formula 3, n is an integer of about 1 to about 13.

Assignees

• Sul Kyung Il
• Uh Dong Seon
• Kim Nam Ju
• Park Kyoung Soo
• Park Young Woo
• Seo Joon Mo
• Yu Arum
• Choi Hyun Min
• Cheil Ind Inc

Inventors

• Sul Kyung Il
• Uh Dong Seon
• Kim Nam Ju
• Park Kyoung Soo
• Park Young Woo
• Seo Joon Mo
• Yu Arum
• Choi Hyun Min

Classifications

• H10W72/352

  comprising metals or metalloids, e.g. solders · CPC title

• H10W72/354

  comprising polymers · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• C08G59/24

  carbocyclic · CPC title