Dense protective coatings, methods for their preparation and coated articles
US-9221720-B2 · Dec 29, 2015 · US
Cutting tool
US9539645B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9539645-B2 |
| Application number | US-201214113727-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 30, 2012 |
| Priority date | Apr 28, 2011 |
| Publication date | Jan 10, 2017 |
| Grant date | Jan 10, 2017 |
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Abstract
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A cutting tool including a substrate composed of a silicon nitride-based sintered body and a coating layer. The coating layer includes first, second, third and fourth layers. The first layer is located on the surface of the substrate and is composed of TiN having an average crystalline width of 0.1 to 0.4 μm. The second layer is located on the first layer and composed of Al 2 O 3 having an average crystalline width of 0.01 to 1.5 μm. The third layer is located on the second layer and is composed of TiN having an average crystalline width of 0.01 to 0.1 μm which is smaller than that of the first layer. The fourth layer is located on the third layer and is composed of Al 2 O 3 having an average crystalline width of 0.01 to 1.5 μm.
First claim
Opening claim text (preview).
What is claimed is: 1. A cutting tool comprising: a substrate composed of a silicon nitride-based sintered body; and a coating layer, the coating layer comprising: a first layer directly disposed on the surface of the substrate, composed of TiN having a first average crystalline width of 0.1 to 0.4 μm; a second layer on the first layer, composed of Al 2 O 3 having a second average crystalline width of 0.01 to 1.5 μm; a third layer on the second layer, composed of TiN havin…
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Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C04B41/89Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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- What does patent US9539645B2 cover?
- A cutting tool including a substrate composed of a silicon nitride-based sintered body and a coating layer. The coating layer includes first, second, third and fourth layers. The first layer is located on the surface of the substrate and is composed of TiN having an average crystalline width of 0.1 to 0.4 μm. The second layer is located on the first layer and composed of Al 2 O 3 having an ave…
- Who is the assignee on this patent?
- Watanabe Takashi, Kyocera Corp
- What technology area does this patent fall under?
- Primary CPC classification C04B41/89. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jan 10 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).