Integrated heat exchanger and power delivery system for high powered electronic modules

Patent metadata

Field	Value
Publication number	US-9538692-B2
Application number	US-201414429099-A
Country	US
Kind code	B2
Filing date	Jul 9, 2014
Priority date	Jul 18, 2013
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

First claim

What is claimed is:

1. An integrated heat exchanger and power delivery system for high powered electronic modules, comprising:
a coolant manifold;
a heat exchanger and power delivery module, wherein the heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold; and
a high powered electronic module, wherein the high powered electronic module comprises an array of sub-modules, wherein the array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements, and wherein the plurality of heat exchanger and power delivery elements are configured to simultaneously deliver power and extract heat away from the sub-modules.

2. The system of claim 1 , wherein the plurality of heat exchanger and power delivery elements comprises bus bars that are scalable to power needs of the array of sub-modules.

3. The system of claim 1 , wherein the plurality of heat exchanger and power delivery elements are configured alternatively to provide positive supply voltage and ground and further configured to carry direct current (DC).

4. The system of claim 1 , wherein the plurality of heat exchanger and power delivery elements are disposed such that they are electrically isolated from each other.

5. The system of claim 1 , wherein the plurality of heat exchanger and power delivery elements are disposed on the coolant manifold such that electrical connectors and connections associated with the sub-modules and rest of the integrated heat exchanger and power delivery system passes through configured gaps between the heat exchanger and power delivery elements.

6. The system of claim 1 , wherein the surfaces of the plurality of heat exchanger and power delivery elements are anodized.

7. The system of claim 1 , wherein each heat exchanger and power delivery element is configured to receive a dielectric coolant to extract heat away from the sub-modules.

8. The system of claim 7 , wherein the dielectric coolant is non-conductive coolant.

9. The system of claim 1 , wherein the coolant manifold is made of high strength and electrically isolating material.

10. The system of claim 9 , wherein the coolant manifold is a glass filled polymer or a dielectrically coated material.

11. The system of claim 1 , wherein the plurality of heat exchanger and power delivery elements are mechanically coupled to the coolant manifold.

12. The system of claim 1 , wherein the sub-modules are thermally coupled to the plurality of heat exchanger and power delivery elements using a thermally conductive epoxy.

Assignees

• Bae Sys Inf & Elect Sys Integ

Inventors

• Sliech Kevin W
• Hedges Stephen A
• Majcher Jared P

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H01R12/52

  connecting to other rigid printed circuits or like structures · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H01L23/473

  Electricity · mapped topic

• H01R4/48

  utilising a spring, clip, or other resilient member (H01R4/52 takes precedence) · CPC title