Bonding structure of electronic equipment

Patent metadata

Field	Value
Publication number	US-9538666-B2
Application number	US-201414218803-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Aug 9, 2013
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

First claim

What is claimed is:

1. A bonding structure of an electronic equipment, comprising:
first electrodes extending in a first direction and arranged in a second direction, the first electrodes being disposed on a stretchable display panel;
second electrodes extending in the first direction and arranged in the second direction, the second electrodes being disposed on a substrate, the second electrodes facing the first electrodes;
solder bonding parts interposed between the first electrodes and the second electrodes, the solder bonding parts facing each other in the second direction and arranged to configure a plurality of rows in the first direction;
first under bump metallization (UBM) pads disposed between the first electrodes and the solder bonding parts;
a first insulating layer disposed on the stretchable display panel, the first insulating layer covering the first electrodes and separating the first UBM pads;
second UBM pads disposed between the second electrodes and the solder bonding parts;
a second insulating layer disposed on the substrate, the second insulating layer covering the second electrodes and separating the second UBM pads; and
an underfill resin layer disposed between the first insulating layer and the second insulating layer.

2. The bonding structure of claim 1 , wherein the stretchable display panel is a liquid crystal display panel, an organic light-emitting diode (OLED) display panel, an electrophoresis display panel, an electrowetting display panel, a microelectromechanical systems (MEMS) display panel or flexible electronics.

3. The bonding structure of claim 1 , wherein the substrate is a semiconductor substrate including an integrated circuit (IC) chip, a flexible substrate, or a wiring substrate, including an IC chip.

4. The bonding structure of claim 1 , wherein:
the first insulating layer exposes portions of top surfaces of the first electrodes; and
the second insulating layer exposes portions of top surfaces of the second electrodes.

5. The bonding structure of claim 4 , wherein the first insulating layer and the second insulating layer are solder resist layers or passivation layers, the solder resist layers being obtained by curing a photoresist, the passivation layers including silicon oxide or silicon nitride.

6. The bonding structure of claim 1 , wherein the first UBM pads and the second UBM pads are a single metal or an alloy, the first UBM pads and the second UBM pads including at least one among titanium (Ti), titanium tungsten (TiW), chromium (Cr), copper (Cu), nickel (Ni), gold (Au), palladium (Pd) and silver (Ag).

7. The bonding structure of claim 1 , wherein the solder bonding parts are a single metal or an alloy, the solder bonding parts including at least one among indium (In), tin (Sn), bismuth (Bi), silver (Ag), copper (Cu), zinc (Zn) and lead (Pb).

8. The bonding structure of claim 1 , further comprising:
a first intermetallic compound layer disposed between the first UBM pads and the solder bonding parts; and
a second intermetallic compound layer disposed between the second UBM pads and the solder bonding parts.

9. The bonding structure of claim 8 , wherein the first intermetallic compound layer is a metal layer including one or more metal elements included in the first UBM pads and one or more metal elements included in the solder bonding parts, and the second intermetallic compound layer is a metal layer including one or more metal elements included in the second UBM pads and one or more metal elements included in the solder bonding parts.

10. A bonding structure of an electronic equipment, comprising:
first electrodes extending in a first direction, the first electrodes being disposed on a stretchable display panel and including row electrodes and column electrodes, the first electrodes being arranged in a second direction, wherein the row electrodes are arranged in the second direction and extending in the first direction, and the column electrodes intersect with the row electrodes such that the column electrodes are arranged in the first direction and extend in the second direction:
second electrodes facing the first electrodes and extending in the first direction, the second electrodes being disposed on a substrate, the second electrodes being arranged in the second direction; and
solder bonding parts interposed between the first electrodes and the second electrodes and arranged to configure a plurality of rows in the first direction, the solder bonding parts facing each other in the second direction;
first under bump metallization (UBM) pads disposed between the first electrodes and the solder bonding parts;
a first insulating layer disposed on the stretchable display panel, the first insulating layer covering the first electrodes and separating the first UBM pads;
second UBM pads disposed between the second electrodes and the solder bonding parts;
a second insulating layer disposed on the substrate, the second insulating layer covering the second electrodes and separating the second UBM pads; and
an underfill resin layer disposed between the first insulating layer and the second insulating layer.

11. The bonding structure of claim 10 , wherein the solder bonding parts are disposed at intersections of the row electrodes and the column electrodes.

12. The bonding structure of claim 10 , wherein the row electrodes and the column electrodes have a curved shape.

13. The bonding structure of claim 10 , further comprising:
a first intermetallic compound layer disposed between the first UBM pads and the solder bonding parts; and
a second intermetallic compound layer disposed between the second UBM pads and the solder bonding parts.

14. A bonding structure of an electronic equipment, comprising:
first electrodes extending in a first direction and arranged in a second direction, the first electrodes being disposed on a stretchable display panel;
second electrodes extending in the first direction and arranged in the second direction, the second electrodes being disposed on a substrate, the second electrodes facing the first electrodes;
solder bonding parts interposed between the first electrodes and the second electrodes, the solder bonding parts facing each other in the second direction and arranged to configure a plurality of rows in the first direction;
first under bump metallization (UBM) layers disposed between the first electrodes and the solder bonding parts, each of the first UBM layers covering a surface of a corresponding one of the first electrodes;
a first insulating layer disposed on the stretchable display panel and between adjacent first UBM layers;
second UBM layers disposed between the second electrodes and the solder bonding parts, each of the second UBM layers covering a surface of a corresponding one of the second electrodes;
a second insulating layer disposed on the substrate and between adjacent second UBM layers; and
an underfill resin layer disposed between the first insulating layer and the second insulating layer.

15. The bonding structure of claim 14 , further comprising:
first intermetallic compound layers disposed between the first UBM layers and the solder bonding parts; and
second intermetallic compound layers disposed between the second UBM layers and the solder bonding parts.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Choi Kwang-Seong
• Bae Hyun-Cheol
• Lee Haksun
• Eom Yong Sung

Classifications

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H05K1/0283

  Stretchable printed circuits · CPC title

• H05K3/3436 Primary

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/10734

  Ball grid array [BGA]; Bump grid array · CPC title