Multichannel RF feedthroughs

Patent metadata

Field	Value
Publication number	US-9538637-B2
Application number	US-201213533895-A
Country	US
Kind code	B2
Filing date	Jun 26, 2012
Priority date	Jun 29, 2011
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.

First claim

The invention claimed is:

1. An optoelectronic module comprising:
an optoelectronic module shell;
a printed circuit board at least partially positioned within the optoelectronic module shell;
an optical subassembly at least partially positioned within the optoelectronic module shell, the optical subassembly including:
an optical subassembly housing;
an optical transducer positioned within the optical subassembly housing;
an optical port defined in the optical subassembly housing through which optical data signals can pass between the optical transducer and an optical fiber; and
a multichannel RF feedthrough formed in the optical subassembly housing, the multichannel RF feedthrough including:
an internal portion located within the optical subassembly housing, the internal portion including a top surface on which first, second, third, and fourth sets of traces are formed, each set of traces configured as an electrical communication channel to carry electrical data signals between the optical transducer and the printed circuit board;
an external portion located outside the optical subassembly housing, the external portion including a top surface on which the second and third sets of traces are formed and a bottom surface on which the first and fourth sets of traces are formed; and
first and second sets of vias connecting the first and fourth sets of traces, respectively, between the top surface of the internal portion located within the optical subassembly housing and the bottom surface of the external portion located outside the optical subassembly housing;

a bottom flexible electrical interface connected to the printed circuit board and the first and fourth sets of traces at the bottom surface of the external portion of the multichannel RF feedthrough; and
a top flexible electrical interface connected to the printed circuit board and the second and third sets of traces at the top surface of the external portion of the multichannel RF feedthrough.

2. The optoelectronic module as recited in claim 1 , wherein the top surface of the internal portion is coplanar with the top surface of the external portion.

3. The optoelectronic module as recited in claim 2 , wherein the multichannel RF feedthrough further includes a ground shield positioned between the top and bottom surfaces of the external portion, the ground shield being electrically grounded to ground traces in the first, second, third, and fourth sets of traces.

4. The optoelectronic module as recited in claim 1 , wherein the top surface of the internal portion is not coplanar with the top surface of the external portion, and the top surface of the internal portion is positioned about half-way between the top and bottom surfaces of the external portion.

5. The optoelectronic module as recited in claim 1 , wherein the spacing between traces in the sets of traces is greater on the top and bottom surfaces of the external portion than on the top surface of the internal portion.

6. The optoelectronic module as recited in claim 1 , wherein the printed circuit board includes an edge connector that extends outside the optoelectronic module shell.

7. The optoelectronic module as recited in claim 1 , wherein the length of each via in the first and second sets of vias is about 0.5 mm.

8. The optoelectronic module as recited in claim 1 , wherein the distance between the top and bottom surfaces of the external portion is about 1 mm.

9. The optoelectronic module as recited in claim 1 , wherein the spacing between traces in the first, second, third, and fourth sets of traces is greater on the top and bottom surfaces of the external portion than on the top surface of the internal portion.

10. The optoelectronic module as recited in claim 1 , wherein the optical transducer includes an optical transmitter.

11. The optoelectronic module as recited in claim 1 , wherein the optical transducer includes an optical receiver.

12. An optoelectronic module comprising:
a shell;
a printed circuit board at least partially positioned within the shell, the printed circuit board including an edge connector that extends outside the shell;
a transmitter optical subassembly at least partially positioned within the shell, the transmitter optical subassembly including:
a transmitter optical subassembly housing;
an optical transmitter positioned within the transmitter optical subassembly housing;
an optical port defined in the transmitter optical subassembly housing through which optical data signals can pass from the optical transmitter to a first optical fiber; and
a first multichannel RF feedthrough formed in the transmitter optical subassembly housing, the first multichannel RF feedthrough including:
an internal portion located within the transmitter optical subassembly housing, the internal portion including a top surface on which first, second, third, and fourth sets of traces are formed, each of the first, second, third, and fourth set of traces electrically connected to the optical transmitter;
an external portion located outside the transmitter optical subassembly housing, the external portion including:
a top surface on which the second and third sets of traces are formed; and
a bottom surface on which the first and fourth sets of traces are formed; and

first and second sets of vias connecting the first and fourth sets of traces, respectively, between the top surface of the internal portion and the bottom surface of the external portion;

a receiver optical subassembly at least partially positioned within the shell, the receiver optical subassembly including:
a receiver optical subassembly housing;
an optical receiver positioned within the receiver optical subassembly housing;
an optical port defined in the receiver optical subassembly housing through which optical data signals can pass from a second optical fiber to the optical receiver; and
a second multichannel RF feedthrough formed in the receiver optical subassembly housing, the second multichannel RF feedthrough including:
an internal portion located within the receiver optical subassembly housing, the internal portion including a top surface on which fifth, sixth, seventh, and eighth sets of traces are formed, each of the fifth, sixth, seventh, and eighth set of traces electrically connected to the optical receiver;
an external portion located outside the receiver optical subassembly housing, the external portion including:
a top surface on which the sixth and seventh sets of traces are formed; and
a bottom surface on which the fifth and eighth sets of traces are formed; and

third and fourth sets of vias connecting the fifth and eighth sets of traces, respectively, between the top surface of the internal portion and the bottom surface of the external portion;

a first flexible electrical interface including:
a first bottom flexible electrical interface connected to the printed circuit board and to the first and fourth sets of traces at the bottom surface of the external portion of the first multichannel RF feedthrough; and
a first top flexible electrical interface connected to the printed circuit board and to the second and third sets of traces at the top surface of the external portion of the first multichannel RF feedthrough; and

a second flexible electrical interface including:
a second bottom flexible electrical interface connected to the printed circuit board and to the fifth and eighth sets of traces at the bottom surface of the external portion of the second multichannel RF feedthrough; and
a second top flexible electrical interface connected to the printed circuit board and to the sixth and seventh sets of traces at the top surface of the

Assignees

• Zhao Yan Yang
• Huebner Bernd
• Du Tengda
• Lee Yuheng
• Finisar Corp

Inventors

• Zhao Yan Yang
• Huebner Bernd
• Du Tengda
• Lee Yuheng

Classifications

• H05K2201/09227

  Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting · CPC title

• H05K1/0274

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K1/0298

  Multilayer circuits · CPC title

• G02B6/4292

  the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements · CPC title