Circuit system and manufacturing method for same

Patent metadata

Field	Value
Publication number	US-9537286-B2
Application number	US-201314404706-A
Country	US
Kind code	B2
Filing date	Apr 11, 2013
Priority date	Jun 1, 2012
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A circuit system includes: a first optoelectronic semiconductor component situated with an n-conductive surface facing an electrically conductive support surface and connected to the support surface in an electrically conductive manner; and a second optoelectronic semiconductor component situated with a p-conductive surface facing the support surface and connected to the support surface in an electrically conductive manner.

First claim

What is claimed is:

1. A circuit system, comprising:
a first optoelectronic semiconductor component comprising (a) a first n-conductive layer, (b) a first p-conductive layer above the first n-conductive layer, and (c) a first top surface, including a first area;
a second optoelectronic semiconductor component comprising (a) a second p-conductive layer, (b) a second n-conductive layer above the second p-conductive layer, and (b) a second top surface, including a second area;
a single electrically conductive support surface shared by the first and second optoelectronic semiconductor components for support of the first and second optoelectronic semiconductor components by and above the support surface, wherein:
surfaces of the first n-conductive layer and the second p-conductive layer face toward the conductive support surface;
the first and second areas of the first and second top surfaces, respectively, face away from the support surface;
the first and the second optoelectronic semiconductor components are connected to the support surface in an electrically conductive manner; and
a connecting area is configured on at least one of: (i) the first top surface within an area that is less than the first area and is over the first n-conductive and p-conductive layers and (ii) the second top surface within an area that is less than the second area and is over the second n-conductive and p-conductive layers; and

at least one bonding wire contacting the connecting area for electrically coupling the circuit system to an external system.

2. The circuit system as recited in claim 1 , wherein the first and second optoelectronic semiconductor components each include multiple semiconductor lasers, wherein the semiconductor lasers include at least one of (i) surface-emitting semiconductor lasers and (ii) edge-emitting semiconductor lasers.

3. The circuit system as recited in claim 1 , wherein at least one of the first and second optoelectronic semiconductor components has an essentially rectangular basic shape having two long sides and two short sides, and the connecting area extends essentially along at least one of the two short sides.

4. The circuit system as recited in claim 3 , wherein both of the first top surface and the second top surface include the connecting area, and wherein the first and second optoelectronic semiconductor components are arranged on the support surface in such a way that the respective connecting areas of the first and second opto-electronic semiconductor components are each associated with the same side of the support surface.

5. The circuit system as recited in claim 3 , wherein both of the first top surface and the second top surface include the connecting area, and wherein the first and second optoelectronic semiconductor components are arranged on the support surface in such a way that the respective connecting areas of the first and second optoelectronic semiconductor components are each associated with respective opposite sides of the support surface.

6. The circuit system as recited in claim 1 , wherein each of the first top surface and second top surface of the optoelectronic semiconductor components has one of an essentially trapezoidal basic shape or an essentially triangular basic shape.

7. The circuit system as recited in claim 6 , wherein in the case of the trapezoidal basic shape, a longer base side of each of the first top surface and second top surface of the optoelectronic semiconductor components has the connecting area.

8. The circuit system as recited in claim 6 , wherein in the case of the trapezoidal basic shape, the first and second optoelectronic semiconductor components are arranged with respect to one another in such a way that shorter base sides of the first top surface and second top surface of the first and second optoelectronic semiconductor components are situated opposite one another.

9. The circuit system as recited in claim 1 , further comprising surface-emitting lasers arranged on the first area and on the second area in a region that is external to the connecting area.

10. An optoelectronic semiconductor circuit comprising:
at least two circuit systems, each including:
a first optoelectronic semiconductor component comprising (a) a first n-conductive layer, (b) a first p-conductive layer above the first n-conductive layer, and (c) a first top surface, including a first area;
a second optoelectronic semiconductor component comprising (a) a second p-conductive layer, (b) a second n-conductive layer above the second p-conductive layer, and (b) a second top surface, including a second area;
a single electrically conductive support surface shared by the first and second optoelectronic semiconductor components for support of the first and second optoelectronic semiconductor components by and above the support surface, wherein:
surfaces of the first n-conductive layer and the second p-conductive layer face toward the conductive support surface;
the first and second areas of the first and second top surfaces, respectively, face away from the support surface;
the first and the second optoelectronic semiconductor components are connected to the support surface in an electrically conductive manner; and
a connecting area is configured on at least one of: (i) the first top surface within an area that is less than the first area and is over the first n-conductive and p-conductive layers and (ii) the second top surface within an area that is less than the second area and is over the second n-conductive and p-conductive layers; and
the at least two circuit systems are electrically connected to one another in series with the aid of at least one of (i) electrically conductive surfaces which are situated in the same plane as the support surfaces, and (ii) bonding wires; and

at least one bonding wire contacting the connecting area for electrically coupling the circuit system to an external system.

11. The semiconductor circuit as recited in claim 10 , wherein the circuit systems are formed and situated relative to one another in such a way that a contour of the semiconductor circuit has one of (i) the shape of a regular n-polygon, where n>4, and (ii) an approximately circular shape.

12. The semiconductor circuit as recited in claim 10 , wherein the circuit systems are formed and situated relative to one another in such a way that at least one of (i) the conductive surfaces and (ii) the bonding wires are situated only in an outer edge area of the semiconductor circuit.

13. A method for manufacturing at least one circuit system, the method comprising:
providing a first optoelectronic semiconductor component comprising (a) a first n-conductive layer, (b) a first p-conductive layer above the first n-conductive layer, and (c) a first top surface, including a first area;
providing a second optoelectronic semiconductor component comprising (a) a second p-conductive layer, (b) a second n-conductive layer above the second p-conductive layer, and (b) a second top surface, including a second area;
providing a single electrically conductive support surface shared by the first and second optoelectronic semiconductor components for support of the first and second optoelectronic semiconductor components by and above the support surface;
connecting the first and the second optoelectronic semiconductor components to the support surface in an electrically conductive manner, such that (a) surfaces of the first n-conductive layer and the second p-conductive layer face toward the conductive support surface and (b) the first and second areas of the first and second top surfaces, respectively, face away from the support surface;
prov

Assignees

• Bosch Gmbh Robert

Inventors

• Letsch Andreas
• Schwarz Hans-Jochen
• Astner Martin

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H01S5/02276

  Electricity · mapped topic

• H01S5/0224

  Electricity · mapped topic

• H01L2224/4847

  Electricity · mapped topic