Optical device wafer processing method

Patent metadata

Field	Value
Publication number	US-9537046-B2
Application number	US-201414453131-A
Country	US
Kind code	B2
Filing date	Aug 6, 2014
Priority date	Aug 6, 2013
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

In an optical device wafer processing method, a light emitting layer on the front side of a wafer is removed by applying a pulsed laser beam to the wafer along division lines from the back side of a substrate with the focal point of the beam set near the light emitting layer, thereby partially removing the light emitting layer along the division lines. A shield tunnel is formed by applying the beam to the wafer along the division lines from the back of the substrate with the focal point of the beam set near the front of the substrate. This forms a plurality of shield tunnels arranged along each division line, each shield tunnel extending from the front side of the substrate to the back side thereof. Each shield tunnel has a fine hole and an amorphous region formed around the fine hole for shielding the fine hole.

First claim

What is claimed is:

1. An optical device wafer processing method for dividing an optical device wafer into individual optical devices along a plurality of crossing division lines, said optical device wafer being composed of a single crystal substrate and a light emitting layer formed on a front side of said single crystal substrate, said optical device wafer being partitioned by said division lines to define a plurality of separate regions where said optical devices are respectively formed, said optical device wafer processing method comprising:
a numerical aperture setting step of setting the numerical aperture (NA) of a focusing lens for focusing a pulsed laser beam so that the value obtained by dividing the numerical aperture (NA) of said focusing lens by the refractive index (N) of said single crystal substrate falls within the range of 0.05 to 0.2;
a light emitting layer removing step of applying said pulsed laser beam to said optical device wafer along said division lines from a back side of said single crystal substrate in a condition where a single focal point of said pulsed laser beam is set near said light emitting layer, thereby partially removing said light emitting layer along said division lines;
a shield tunnel forming step of applying said pulsed laser beam to said optical device wafer along said division lines from the back side of said single crystal substrate in a condition where a single focal point of said pulsed laser beam is set near the front side of said single crystal substrate after performing said light emitting layer removing step, thereby forming a plurality of shield tunnels arranged along each division line, each shield tunnel extending continuously from the front side of said single crystal substrate to the back side thereof, each shield tunnel being composed of a fine hole and an amorphous regions formed around said fine hole for shielding said fine hole; and
a dividing step of applying an external force to said optical device wafer after performing said shield tunnel forming step, thereby dividing said optical device wafer into said individual optical devices;
said pulsed laser beam being applied in said light emitting layer removing step with an energy smaller than that of said pulsed laser beam to be applied in said shield tunnel forming step in a condition where the focused spots of said pulsed laser beam are overlapped.

2. The optical device wafer processing method according to claim 1 , wherein the energy of said pulsed laser beam to be applied in said light emitting layer removing step is set to 2 to 6 μJ/pulse, and the energy of said pulsed laser beam to be applied in said shield tunnel forming step is set to 30 μJ/pulse or more.

Assignees

• Disco Corp

Inventors

• Takeda Noboru
• Morikazu Hiroshi

Classifications

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P34/422

  using incoherent radiation · CPC title

• H10H20/01 Primary

  Manufacture or treatment · CPC title

• H01L21/2686

  Electricity · mapped topic

• H01L33/0095 Primary

  Electricity · mapped topic