Interconnect for an optoelectronic device

Patent metadata

Field	Value
Publication number	US-9537036-B2
Application number	US-201414303854-A
Country	US
Kind code	B2
Filing date	Jun 13, 2014
Priority date	Sep 29, 2010
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body.

First claim

What is claimed is:

1. An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends of the interconnect body; and
a first narrow slot disposed within the interconnect body and comprising an opening at the inner surface of the interconnect body, wherein the first narrow slot does not extend through to the outer surface of the interconnect body, does not extend through to the first end of the interconnect body, and does not extend through to the second end of the interconnect body.

2. The interconnect of claim 1 , wherein the first narrow slot is positioned in a location approximately equally between the first and second ends of the interconnect body.

3. The interconnect of claim 2 , further comprising:
a second narrow slot in a location proximate to the first end of the interconnect body and distal from the second end of the interconnect body, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface of the interconnect body; and
a third narrow slot between the second narrow slot and the first end of the interconnect body, the third narrow slot between and orthogonal to the inner and outer surfaces of the interconnect body, but not opening into either of the inner and outer surfaces of the interconnect body.

4. The interconnect of claim 1 , further comprising:
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

5. The interconnect of claim 2 , further comprising:
a second narrow slot in a location proximate to the first end of the interconnect body and distal from the second end of the interconnect body, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface of the interconnect body;
a third narrow slot between the second narrow slot and the first end of the interconnect body, the third narrow slot between and orthogonal to the inner and outer surfaces of the interconnect body, but not opening into either of the inner and outer surfaces of the interconnect body; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

6. The interconnect of claim 1 , wherein the interconnect is a coupling interconnect.

7. The interconnect of claim 1 , wherein the interconnect is a terminal interconnect.

8. An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
a first narrow slot disposed within the interconnect body and comprising an opening at the inner surface of the interconnect body, wherein the first narrow slot does not extend through to the outer surface of the interconnect body, does not extend through to the first end of the interconnect body, and does not extend through to the second end of the interconnect body, and wherein the first narrow slot is positioned in a location approximately equally between the first and second ends of the interconnect body;
a first L-shaped extension at the first end of the interconnect body; and
a second L-shaped extension at the second end of the interconnect body, the horizontal bases of each of the first and second L-shaped extensions proximate to the inner surface of the interconnect body and distal from the outer surface of the interconnect body.

9. The interconnect of claim 8 , further comprising:
a second narrow slot in a location proximate to the first end of the interconnect body and distal from the second end of the interconnect body, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface of the interconnect body; and
a third narrow slot between the second narrow slot and the first end of the interconnect body, the third narrow slot between and orthogonal to the inner and outer surfaces of the interconnect body, but not opening into either of the inner and outer surfaces of the interconnect body.

10. The interconnect of claim 8 , further comprising:
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

11. The interconnect of claim 8 , further comprising:
a second narrow slot in a location proximate to the first end of the interconnect body and distal from the second end of the interconnect body, the second narrow slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface of the interconnect body;
a third narrow slot between the second narrow slot and the first end of the interconnect body, the third narrow slot between and orthogonal to the inner and outer surfaces of the interconnect body, but not opening into either of the inner and outer surfaces of the interconnect body; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

12. The interconnect of claim 8 , wherein the interconnect is a coupling interconnect.

13. The interconnect of claim 8 , wherein the interconnect is a terminal interconnect.

14. An interconnect for an optoelectronic device, the interconnect comprising:
an interconnect body comprising an inner surface, an outer surface, a first end, and a second end;
a plurality of bond pads coupled to the inner surface of the interconnect body, between the first and second ends;
a first slot disposed entirely within the interconnect body without extending through to the inner surface of the interconnect body, without extending through to the outer surface of the interconnect body, without extending through to the first end of the interconnect body, and without extending through to the second end of the interconnect body; and
a vertical jog near to or at the location where one of the plurality of bond pads is coupled to the inner surface of the interconnect body.

15. The interconnect of claim 14 , further comprising:
a second slot in a location proximate to the first end of the interconnect body and distal from the second end of the interconnect body, the second slot comprising an opening at the outer surface of the interconnect body and extending into the interconnect body, but not through to the inner surface of the interconnect body; and
a third slot between the second slot and the first end of the interconnect body, the third slot between and orthogonal to the inner and outer surfaces of the interconnect body, but not opening into either of the inner and outer surfaces of the interconnect body.

16. The interconnect of claim 14 , wherein the interconnect is a coupling interconnect.

17. The interconnect of claim 14 , wherein the interconnect is a terminal interconnect.

Assignees

• Sunpower Corp

Inventors

• Linderman Ryan
• Johnston Keith
• Phu Thomas
• Dawson Matthew

Classifications

• H10W70/411

  Chip-supporting parts, e.g. die pads · CPC title

• H10F19/80 Primary

  Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells · CPC title

• H10F19/902

  for series or parallel connection of photovoltaic cells · CPC title

• H10F77/63

  Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling · CPC title

• H10F19/908

  for back-contact photovoltaic cells · CPC title