Device for radiofrequency (RF) transmission with an integrated electromagnetic wave reflector

Patent metadata

Field	Value
Publication number	US-9536845-B2
Application number	US-201615040354-A
Country	US
Kind code	B2
Filing date	Feb 10, 2016
Priority date	Feb 11, 2015
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

RF transmission device including at least:
a substrate comprising first and second faces opposite to each other; a first RF transmission electronic circuit arranged on and/or in the substrate; a first antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit; a first electromagnetic wave reflector coupled to the first antenna and including:
a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure and arranged on the first face of the substrate opposite the first antenna; a first electrically conducting ground plane arranged at least partially opposite the first antenna.

First claim

The invention claimed is:

1. RF transmission device including at least:
a substrate comprising first and second faces opposite to each other;
a first RF transmission electronic circuit arranged on and/or in the substrate;
a first antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;
a first electromagnetic wave reflector coupled to the first antenna and including at least:
a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure and arranged on the first face of the substrate opposite the first antenna;
a first electrically conducting ground plane arranged at least partially opposite the first antenna.

2. Device according to claim 1 , in which the first RF transmission electronic circuit is arranged at the first face of the substrate.

3. Device according to claim 1 , in which the first electrically conducting ground plane is arranged on the second face of the substrate.

4. Device according to claim 1 , further comprising a first dielectric layer arranged on the first face of the substrate, surrounding the first RF transmission electronic circuit and on which the first antenna is arranged.

5. Device according to claim 1 , further comprising a cavity delimited by the first high impedance surface and by a suspended membrane on which at least the first antenna is arranged.

6. Device according to claim 1 , in which a distance between the first antenna and the first electrically conducting ground plane is less than or equal to around a tenth of a central wavelength of first RF signals intended to be transmitted and/or received by the first antenna.

7. Device according to claim 1 , in which each first electrically conducting element of the first high impedance surface comprises one or more flat conducting portions arranged beside each other and/or in different planes superimposed on each other, the first high impedance surface further comprising a second dielectric layer in which are arranged the first electrically conducting elements.

8. Device according to claim 7 , in which each first electrically conducting element of the first high impedance surface further comprises at least one vertical conducting portion connected to the or at least to one of the flat conducting portions of said first electrically conducting element.

9. Device according to claim 1 , further comprising:
several first electrically conducting vias crossing through at least the substrate and electrically connected to the first RF transmission electronic circuit, and/or
several second electrically conducting vias crossing through at least the substrate and arranged around the first antenna while forming a guard ring around the first antenna, and/or
several third heat conducting vias crossing through at least the substrate and arranged under the first RF transmission circuit.

10. Device according to claim 9 , in which the third heat conducting vias are electrically conducting.

11. Device according to claim 1 , further comprising at least:
a second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;
a second electromagnetic wave reflector coupled to the second antenna and including at least:
a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;
a second electrically conducting ground plane arranged at least partially opposite the second antenna.

12. Device according to claim 1 , further comprising at least:
a second RF transmission electronic circuit arranged on and/or in the substrate;
a second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the second RF transmission electronic circuit;
a second electromagnetic wave reflector coupled to the second antenna and including at least:
a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;
a second electrically conducting ground plane arranged at least partially opposite the second antenna.

13. Device according to claim 11 , in which the second electrically conducting ground plane is arranged on the second face of the substrate.

14. Device according to claim 12 , in which the second electrically conducting ground plane is arranged on the second face of the substrate.

15. Device according to claim 11 , in which the first and second electrically conducting elements of the first and second high impedance surfaces are arranged in a same second dielectric layer on which is arranged at least the first RF transmission electronic circuit.

16. Device according to claim 12 , in which the first and second electrically conducting elements of the first and second high impedance surfaces are arranged in a same second dielectric layer on which is arranged at least the first RF transmission electronic circuit.

17. Device according to claim 1 , further comprising a printed circuit to which the substrate is joined and to which at least the first RF transmission electronic circuit is electrically connected.

18. Device according to claim 17 , in which the substrate is connected mechanically and electrically to the printed circuit through the intermediary of a plurality of conducting beads regularly spread out on the second face of the substrate.

19. Method for producing a RF transmission device, including at least the steps of:
forming, on a first face of a substrate, a first high impedance surface comprising at least several first electrically conducting elements forming a first periodic structure;
transferring a first RF transmission electronic circuit onto and/or into the substrate;
forming a first antenna arranged on the side of the first face of the substrate and opposite the first electrically conducting elements, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit;
forming a first electrically conducting ground plane at least partially opposite the first antenna;
and in which the first high impedance surface and the first electrically conducting ground plane together form a first electromagnetic wave reflector coupled to the first antenna.

20. Method according to claim 19 , further comprising the steps of:
forming at least one second antenna arranged on the side of the first face of the substrate, spaced apart from the first face of the substrate and electrically connected to the first RF transmission electronic circuit or to a second RF transmission electronic circuit transferred onto and/or into the substrate;
forming at least one second electromagnetic wave reflector coupled to the second antenna and including at least:
a second high impedance surface comprising at least several second electrically conducting elements forming a second periodic structure and arranged on the first face of the substrate opposite the second antenna;
a second electrically conducting ground plane arranged at least partially opposite the second antenna.

Assignees

• Commissariat Energie Atomique

Inventors

• Lamy Yann
• Dussopt Laurent
• El Bouayadi Ossama
• Moknache Amazir

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W44/248

  for antennas · CPC title