Multilayered heat-recoverable article, wire splice, and wire harness

Patent metadata

Field	Value
Publication number	US-9536637-B2
Application number	US-201314394843-A
Country	US
Kind code	B2
Filing date	Sep 18, 2013
Priority date	Dec 20, 2012
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A multilayered heat-recoverable article 1 includes a base material layer 10 and an adhesive layer 11 disposed on the inner side of the base material layer 10 . The adhesive layer 11 includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor. The shear viscosity at 150° C. of the adhesive layer 11 is 300 Pa·s or more at a shear rate of 0.1 s −1 and 200 Pa·s or less at a shear rate of 100s −1 .

First claim

The invention claimed is:

1. A multilayered heat-recoverable article comprising a base material layer and an adhesive layer disposed on an inner side of the base material layer,
characterized in that the adhesive layer includes [A] a thermoplastic resin having a melt flow rate of 15 g/10 min to 1,000 g/10 min at 190° C. and a load of 2.16 kg, [B] an organically treated layered silicate, and [C] a deterioration inhibitor;
the shear viscosity at 150° C. of the adhesive layer is 300 Pa·s or more at a shear rate of 0.1 s −1 and 200 Pa·s or less at a shear rate of 100 s −1 ; and
the deterioration inhibitor [C] is at least one selected from the group consisting of activated clay and hydrotalcite.

2. The multilayered heat-recoverable article according to claim 1 , wherein the content of the deterioration inhibitor [C] is 25% to 300% by mass relative to the organically treated layered silicate [B].

3. The multilayered heat-recoverable article according to claim 1 , wherein the content of the organically treated layered silicate [B] is 1 to 15 parts by mass relative to 100 parts by mass of the thermoplastic resin [A].

4. The multilayered heat-recoverable article according to claim 1 , wherein the storage elastic modulus at 110° C. of the adhesive layer is 0.1 MPa or less.

5. The multilayered heat-recoverable article according to claim 1 , wherein, in the case where the multilayered heat-recoverable article is used to cover an insulated wire which includes a conductor and a polyvinyl chloride layer provided on the outer periphery thereof, cracks do not occur in the polyvinyl chloride layer under heating conditions at 150° C. and for 200 hours.

6. The multilayered heat-recoverable article according to claim 1 , wherein the thermoplastic resin [A] is at least one of an ethylene-vinyl acetate copolymer and a polyamide.

7. The multilayered heat-recoverable article according to claim 1 , wherein the base material layer includes at least one selected from the group consisting of a polyethylene, a polyester, a polyamide, and a fluororesin.

8. A wire splice comprising:
a plurality of wires, each including a conductor and an insulating layer provided on the outside thereof; and
the multilayered heat-recoverable article according to claim 1 made to adhere to a joint in which the conductors of the plurality of wires are connected to each other.

9. The wire splice according to claim 8 , wherein the insulating layer includes, as a main component, polyvinyl chloride.

10. A wire harness comprising:
a plurality of wires, each including a conductor and an insulating layer provided on the outside thereof; and
the multilayered heat-recoverable article according to claim 1 made to adhere to the plurality of wires.

11. The wire harness according to claim 10 , wherein the insulating layer includes, as a main component, polyvinyl chloride.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Fine Polymer Inc

Inventors

• Yamasaki Satoshi
• Nishikawa Shinya
• Fujita Ryouhei
• Emoto Yasutaka

Classifications

• H02G15/1806

  Heat shrinkable sleeves (insulation of electrical connections using a heat shrinking insulating sleeve H01R4/72) · CPC title

• H02G3/0481

  with a circular cross-section (H02G3/0468, H02G3/0475 take precedence) · CPC title

• H01B3/448 Primary

  from other vinyl compounds · CPC title

• B32B27/22

  using plasticisers · CPC title

• H01B3/305

  Polyamides or polyesteramides · CPC title