Multiple-ply solid state light fixture

Patent metadata

Field	Value
Publication number	US-9534739-B2
Application number	US-201314080986-A
Country	US
Kind code	B2
Filing date	Nov 15, 2013
Priority date	Nov 15, 2013
Publication date	Jan 3, 2017
Grant date	Jan 3, 2017

Abstract

A multiple-ply solid state light fixture is disclosed. A panelized, solid state light fixture includes combined layers of material chemically bonded together without a traditional mechanical housing and with relatively few or no fasteners. In example embodiments, the solid state light fixture includes an LED mounting substrate, a thermal material on a non-LED side of the LED mounting substrate, and an optical material on the LED side of the LED mounting substrate. A plurality of LEDs are disposed or mounted, with or without additional packaging, on the LED side of the LED mounting substrate. A chemical bond is created between the substrate and the other layers. This chemical bond can be created, for example, through use of applied fluid or gelatinous compounds that are then solidified, or through the use of adhesives.

First claim

The invention claimed is:

1. A panelized, solid state light fixture comprising:
an LED mounting substrate;
a solidified thermal material bonded to a non-LED side of the LED mounting substrate to impart a plenum application rating to the solid state light fixture;
a plurality of LEDs on an LED side of the LED mounting substrate;
an optical material on the LED side of the LED mounting substrate; and
a supporting frame and enclosure for at least some power supply circuitry on the non-LED side of the LED mounting substrate, wherein the supporting fame and enclosure form a unitary structure, the supporting frame containing the solidified thermal material;
wherein the solidified thermal material, the optical material, and the substrate form the solid state light fixture as a multiple-ply, relatively flat solid object.

2. The panelized, solid state light fixture of claim 1 wherein the LED mounting substrate is chemically bonded to at least one of the solidified thermal material and the optical material.

3. The panelized, solid state light fixture of claim 2 wherein the solidified thermal material comprises a potting compound.

4. The panelized, solid state light fixture of claim 3 wherein the optical material comprises at least one of silicone and acrylic.

5. The panelized, solid state light fixture of claim 2 wherein at least some of the power supply circuitry is distributed on at least one of the non-LED side and the LED side of the LED mounting substrate.

6. The panelized, solid state light fixture of claim 2 further comprising a control input for at least some of the plurality of LEDs.

7. The panelized, solid state light fixture of claim 6 wherein the control input comprises a local area network (LAN) connector.

8. A method of assembling a panelized, solid state light fixture, the method comprising:
mounting a plurality of LEDs on a substrate;
installing a supporting frame and enclosure on the substrate, wherein the supporting frame and enclosure form a unitary structure;
installing power supply circuitry in an enclosure and connecting the power supply circuitry to the plurality of LEDs;
imparting a plenum application rating to the panelized, solid date light fixture by applying thermal material to a non-LED side of the substrate so that the thermal material is contained by the supporting frame and solidifies and becomes chemically bonded to the substrate; and
applying an optical material to an LED side of the substrate so that the optical material is chemically bonded to the substrate, and the thermal material, the optical material, and the substrate form the solid state light fixture as a multiple-ply, relatively flat solid object that is of appropriate size for use in a tiled ceiling.

9. The method of claim 8 wherein the applying of the thermal material comprises applying a fluid or gelatinous potting compound and allowing or causing the potting compound to solidify.

10. The method of claim 9 wherein the applying of the optical material further comprises applying a fluid or gelatinous optical compound and allowing or causing the optical compound to solidify.

11. A panelized, solid state light fixture comprising:
an LED mounting substrate;
a supporting frame and enclosure on the LED mounting substrate, wherein the supporting frame and enclosure form a unitary structure;
a solidified thermal material contained in the supporting frame and chemically bonded to a non-LED side of the LED mounting substrate to impart a plenum application rating to the solid state light fixture;
a plurality of LEDs on an LED side of the LED mounting substrate;
power supply circuitry connected to the plurality of LEDs; and
an optical material chemically bonded to the LED side of the LED mounting substrate;
wherein the the thermal material, the optical material, and the LED mounting substrate form the panelized, solid state light fixture as a multiple-ply, relatively flat solid object.

12. The light fixture of claim 11 wherein the thermal material comprises a solidified potting compound.

13. The light fixture of claim 12 further comprising a second supporting frame on the LED side of the LED mounting substrate.

14. The light fixture of claim 12 wherein the optical material further comprises a solidified optical compound.

Assignees

• Cree Inc

Inventors

• Lay James Michael

Classifications

• F21V23/005

  the substrate is supporting also the light source · CPC title

• F21S8/043

  mounted by means of a rigid support, e.g. bracket or arm · CPC title

• Y10T29/49146

  with encapsulating, e.g., potting, etc. · CPC title

• F21Y2105/10

  comprising a two-dimensional [2D] array of point-like light-generating elements · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title