Aqueous resinous dispersions that include a zinc (II) amidine complex and methods for the manufacture thereof

US9534074B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9534074-B2
Application numberUS-201213531935-A
CountryUS
Kind codeB2
Filing dateJun 25, 2012
Priority dateJun 25, 2012
Publication dateJan 3, 2017
Grant dateJan 3, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Disclosed herein are stable aqueous resinous dispersions and methods for forming such dispersions that include a zinc (II) amidine complex.

First claim

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We claim: 1. An aqueous resinous blend comprising: (a) a first aqueous resinous dispersion comprising: (i) an active hydrogen-containing, cationic salt group-containing polymer; and (ii) a zinc (II) amidine complex; and (b) a second aqueous resinous dispersion comprising: (i) an active hydrogen-containing, cationic salt group-containing polymer; and (ii) an at least partially blocked polyisocyanate that is selected so as to provide an aqueous resinous dispersion that cures at a temperature of 320° F. or below, wherein the aqueous resinous blend is a stable dispersion. 2. The blend of claim 1 , wherein the active hydrogen-containing, cationic salt group-containing polymer comprises an ungelled polyepoxide-polyoxyalkylenepolyamine resin. 3. The blend of claim 2 , wherein the active hydrogen-containing, cationic salt group-containing polymer further comprises a polyepoxide-amine adduct, wherein a portion of the amine that is reacted with the polyepoxide is a ketimine of a polyamine. 4. The blend of claim 1 , wherein the zinc (II) amidine complex comprises amidine and carboxylate ligands. 5. The blend of claim 1 , wherein the at least partially blocked polyisocyanate comprises a urethane-containing material having a moiety of the structure (3): in which R is H, an alkyl, alkenyl, or aryl group, and X is H, an alkyl, alkenyl, an aryl group, or —N(R 1 )(R 2 ), in which R 1 and R 2 are, each independently, H, an alkyl, an alkenyl, or an aryl group. 6. The blend of claim 1 , wherein the blend cures at a temperature of 250° F. to 320° F. 7. The blend of claim 6 , wherein the blend cures at a temperature of 275° F. to 320° F. 8. A method comprising placing the blend of claim 1 in contact with an electrically conductive anode and an electrically conductive cathode, with a surface to be coated being the cathode. 9. A method for making an aqueous resinous blend comprising combining a first aqueous resinous dispersion with a second aqueous resinous dispersion, wherein: (a) the first aqueous resinous dispersion comprises: (i) an active hydrogen-containing, cationic salt group-containing polymer; and (ii) a zinc (II) amidine complex; and (b) the second aqueous resinous dispersion comprises: (i) an active hydrogen-containing, cationic salt group-containing polymer; and (ii) an at least partially blocked polyisocyanate. 10. The method of claim 9 , wherein the first aqueous resinous dispersion and the second aqueous resinous dispersion are both a stable dispersion. 11. The method of claim 9 , wherein the active hydrogen-containing, cationic salt group-containing polymer present in the first aqueous resinous dispersion comprises an ungelled polyepoxide-polyoxyalkylenepolyamine resin. 12. The method of claim 11 , wherein the active hydrogen-containing, cationic salt group-containing polymer present in the second aqueous dispersion comprises a polyepoxide-amine adduct, wherein a portion of the amine that is reacted with the polyepoxide is a ketimine of a polyamine. 13. The method of claim 9 , wherein the zinc (II) amidine complex comprises amidine and carboxylate ligands. 14. The method of claim 9 , wherein the zinc (II) amidine complex is present in the first aqueous resinous dispersion in an amount of 10 to 30 percent by weight, based on the total solids weight of the first aqueous resinous dispersion. 15. The method of claim 9 , wherein the first aqueous resinous dispersion is substantially free of any at least partially blocked polyisocyanate. 16. The method of claim 9 , wherein the first aqueous resinous dispersion is substantially free of tin-containing metal catalyst. 17. The method of claim 9 , wherein the at least partially blocked polyisocyanate is selected so as to provide an aqueous resinous blend that cures at a temperature of 320° F. or below when combined with the first aqueous dispersion. 18. The method of claim 9 , wherein the at least partially blocked polyisocyanate comprises a urethane-containing material having a moiety of the structure (3): in which R is H, an alkyl, alkenyl, or aryl group, and X is H, an alkyl, alkenyl, an aryl group, or —N(R 1 )(R 2 ), in which R 1 and R 2 are, each independently, H, an alkyl, an alkenyl, or an aryl group. 19. A method of coating a substrate, comprising placing the blend produced by the method of claim 9 in contact with an electrically conductive anode and an electrically conductive cathode, with a surface to be coated being the cathode. 20. The blend of claim 1 , wherein at least a portion of the isocyanato groups of the at least partially blocked polyisocyanate have been reacted with a compound so that the resultant capped isocyanate portion is stable to hydroxyl or amine groups at room temperature but reactive with hydroxyl or amine groups at a temperature of 200° F. or higher.

Assignees

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Classifications

  • by cathodic processes · CPC title

  • Polyurethanes · CPC title

  • having nitrogen · CPC title

  • being toluene diisocyanate including isomer mixtures · CPC title

  • characterised by the additives used (C09D5/4403 - C09D5/4476, C09D5/4492 take precedence) · CPC title

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What does patent US9534074B2 cover?
Disclosed herein are stable aqueous resinous dispersions and methods for forming such dispersions that include a zinc (II) amidine complex.
Who is the assignee on this patent?
Eswarakrishnan Venkatachalam, Gray Andrea, Love Jonathan A, and 3 more
What technology area does this patent fall under?
Primary CPC classification C08G18/0814. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 03 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).