High-frequency module

Patent metadata

Field	Value
Publication number	US-9532475-B2
Application number	US-201615016915-A
Country	US
Kind code	B2
Filing date	Feb 5, 2016
Priority date	Mar 18, 2013
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A high-frequency module includes a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded, an upper substrate disposed inside the recess part of the lower base member. The high frequency module also includes a semiconductor device and a first ground metal part connected to the base metal part and disposed in the lower base member. The upper substrate has a first through hole formed therethrough at a position where the first ground metal part is situated, and the semiconductor device is placed on the first ground metal part in the first through hole.

First claim

What is claimed is:

1. A high-frequency module, comprising:
a lower base member having a recess part formed in an upper face thereof, and having a base metal part formed on a lower face thereof that is to be grounded;
an upper substrate disposed inside the recess part of the lower base member;
a semiconductor device; and
a first ground metal part connected to the base metal part and disposed in the lower base member,
wherein the upper substrate has a first through hole formed therethrough at a position where the first ground metal part is situated, and the semiconductor device is placed on the first ground metal part in the first through hole.

2. The high-frequency module as claimed in claim 1 , wherein the semiconductor device is connected to the first ground metal part, and a second ground metal part connected to the base metal part is disposed in the lower base member, and wherein the upper substrate has a second through hole formed therethrough into which the second ground metal part intrudes, and a ground line formed on an upper face of the upper substrate is connected to the second ground metal part intruding into the second through hole.

3. The high-frequency module as claimed in claim 2 , wherein the second ground metal part has a step part formed thereon, and a ground line formed on a lower face of the upper substrate is connected to the second ground metal part at the step part of the second ground metal part.

4. The high-frequency module as claimed in claim 1 , wherein the first ground metal part has a step part formed thereon, and a ground line formed on a lower face of the upper substrate is connected to the first ground metal part at the step part of the first ground metal part.

5. The high-frequency module as claimed in claim 1 , wherein the first ground metal part and the second ground metal part are made of material containing copper.

Assignees

• Fujitsu Ltd

Inventors

• Masuda Satoshi

Classifications

• H05K1/0215

  Grounding of printed circuits by connection to external grounding means · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K1/021

  Components thermally connected to metal substrates or heat-sinks by insert mounting · CPC title

• H05K2201/1056

  Metal over component, i.e. metal plate over component mounted on or embedded in PCB · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title