Optical module and method of manufacturing optical module

Patent metadata

Field	Value
Publication number	US-9530907-B2
Application number	US-201514791782-A
Country	US
Kind code	B2
Filing date	Jul 6, 2015
Priority date	Jul 7, 2014
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An optical module includes an optical semiconductor device and a stem including a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device. The optical module also includes a substrate having a ground layer, a first opening through which the lead terminal passes, and a connecting portion configured to electrically connect the stem and the ground layer. The connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.

First claim

What is claimed is:

1. An optical module, comprising:
an optical semiconductor device;
a stem comprising a lead terminal configured to perform at least one of transmitting an electric signal to the optical semiconductor device or transmitting an electric signal output from the optical semiconductor device; and
a substrate comprising a ground layer, a first opening through which the lead terminal passes, a connecting portion configured to electrically connect the stem and the ground layer, and a transmission line electrically connected to the lead terminal,
wherein the connecting portion is formed on one of an edge portion of the substrate and a surface of the substrate on a side on which the substrate is arranged on the stem.

2. The optical module according to claim 1 , wherein the connecting portion formed on the edge portion of the substrate comprises an electrode portion formed extending from the ground layer in a notch of the substrate.

3. The optical module according to claim 1 , wherein the connecting portion formed on the surface of the substrate on the side on which the substrate is arranged on the stem is formed so that the ground layer is exposed at a part of an outer side of a region of the substrate at which the substrate and the stem oppose each other.

4. The optical module according to claim 1 ,
wherein the stem further comprises a ground pin extending from a surface of the stem on a side on which the substrate is arranged, and
wherein the substrate further comprises a second opening through which the ground pin passes.

5. The optical module according to claim 1 ,
wherein the transmission line comprises a straight region and a matching region having a larger width than the straight region.

6. The optical module according to claim 5 , wherein the connecting portion is formed between a position at which the lead terminal and the transmission line of the substrate are connected to each other and a position at which the substrate is to be bent.

7. The optical module according to claim 1 , wherein the connecting portion is electrically connected to the stem by a solder portion.

Assignees

• Oclaro Japan Inc

Inventors

• Noguchi Daisuke
• Hirai Masahiro
• Yamamoto Hiroshi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H01L31/024 Primary

  Electricity · mapped topic

• H01L31/0203

  Electricity · mapped topic

• H01L33/483

  Electricity · mapped topic

• Y02P70/521

  Cross-Sectional Technologies · mapped topic