Package on package (PoP) device comprising a high performance inter package connection

Patent metadata

Field	Value
Publication number	US-9530739-B2
Application number	US-201514609289-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Dec 15, 2014
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

A package on package (PoP) device includes a first package and a second package. The first package includes a first package substrate, a die coupled to the first package substrate, an encapsulation layer located on the first package substrate, and an inter package connection coupled to the first package substrate. The inter package connection is located in the encapsulation layer. The inter package connection includes a first interconnect configured to provide a first electrical path for a reference ground signal, and a second set of interconnects configured to provide at least one second electrical path for at least one second signal. The first interconnect has a length that is at least about twice as long as a width of the first interconnect. The second set of interconnects is configured to at least be partially coupled to the first interconnect by an electric field.

First claim

What is claimed is:

1. An integrated device package comprising:
a first package substrate;
a first die coupled to the first package substrate;
an encapsulation layer located on the first package substrate; and
an inter package connection coupled to the first package substrate, the inter package connection located at least partially in the encapsulation layer, the inter package connection comprising:
a first interconnect providing a first electrical path for a reference grou…

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Hwang Kyu-Pyung

Classifications

• H10W90/734

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic

• H10W90/701

  Electricity · mapped topic

• H10W74/15

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic