Manufacturing method for linear-grid of display panel
US-2015378210-A1 · Dec 31, 2015 · US
Energy-sensitive resin composition
US9529258B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9529258-B2 |
| Application number | US-201314758199-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 25, 2013 |
| Priority date | Dec 28, 2012 |
| Publication date | Dec 27, 2016 |
| Grant date | Dec 27, 2016 |
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Abstract
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The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.
First claim
Opening claim text (preview).
What is claimed is: 1. An energy-sensitive resin composition comprising polyamic acid, a solvent, and a compound (A), wherein the polyamic acid is obtained by reacting tetracarboxylic dianhydride with diamine, the compound (A) comprises at least one of: a compound (A-1) that decomposes by the action of at least one of light and heat and generates an imidazole compound; and an oxime ester compound (A-2), wherein the compound (A-1) is represented by the following formula (4) or a…
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Physics · mapped topic
Physics · mapped topic
- G03F7/0041Primary
Physics · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US9529258B2 cover?
- The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperatur…
- Who is the assignee on this patent?
- Tokyo Ohka Kogyo Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification G03F7/0041. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).