Optical wiring substrate, manufacturing method of optical wiring substrate and optical module

Patent metadata

Field	Value
Publication number	US-9529163-B2
Application number	US-201414200297-A
Country	US
Kind code	B2
Filing date	Mar 7, 2014
Priority date	May 7, 2013
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

First claim

What is claimed is:

1. An optical wiring substrate, comprising:
an insulation layer comprising a resin;
a first conductor layer formed on one side of the insulation layer and comprising a metal, the first conductor layer comprising an inclined surface that is inclined relative to an optical axis of an optical fiber,
a second conductor layer formed on an opposite side of the insulation layer and comprising a metal, the second conductor layer supporting the optical fiber,
wherein the insulation layer further comprises an end surface that faces a cladding of the optical fiber, and wherein the inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.

2. The optical wiring substrate according to claim 1 , further comprising:
an accommodating part configured to extend along a longitudinal direction of the optical fiber so as to accommodate at least a part of the optical fiber, the accommodating part being formed over a whole of the first conductor layer and the insulation layer in a thickness direction thereof; and
the second conductor layer comprising a supporting surface for supporting the optical fiber that is accommodated in the accommodating part and arranged parallel to the first conductor layer across the insulation layer,
wherein the end surface is formed at one end of the accommodating part in the longitudinal direction.

3. The optical wiring substrate according to claim 1 , wherein the insulation layer is configured such that a dimension thereof in the thickness direction is not less than 0.8 times and not more than 1.2 times relative to a thickness dimension of the cladding of the optical fiber in the diameter direction.

4. The optical wiring substrate according to claim 1 , wherein the insulation layer further comprises an accommodating groove formed therein along the longitudinal direction of the optical fiber so as to accommodate at least a part of the optical fiber, and wherein the optical fiber is supported by a bottom surface of the accommodating groove.

5. An optical module, comprising:
the optical wiring substrate according to claim 1 ; and
a photoelectric conversion element mounted on the optical wiring substrate.

6. A manufacturing method of the optical wiring substrate according to claim 1 , comprising:
forming the first conductor layer on a front surface of the insulation layer;
removing a part of the first conductor layer so as to form a wiring pattern;
forming the inclined surface in the first conductor layer; and
removing a part of the insulation layer so as to form the end surface.

7. A manufacturing method of the optical wiring substrate according to claim 2 , comprising:
forming the first conductor layer on a front surface of the insulation layer, and forming the second conductor layer in a rear surface of the insulation layer;
removing a part of the first conductor layer so as to form a wiring pattern and a concave part as the accommodating part;
forming the inclined surface in the first conductor layer; and
removing the whole of the insulation layer corresponding to a bottom surface of the concave part in the thickness direction up to the second conductor layer, so as to form the accommodating part, and to form the end surface that faces the cladding of the optical fiber.

8. The manufacturing method of the optical wiring substrate according to claim 4 , comprising:
forming the first conductor layer on a front surface of the insulation layer;
removing a part of the first conductor layer so as to form a wiring pattern and a concave part as the accommodating groove;
forming the inclined surface in the first conductor layer; and
removing the insulation layer corresponding to a bottom surface of the concave part, so as to form the accommodating groove, and to form the end surface that faces the cladding of the optical fiber at one end of the accommodating groove.

Assignees

• Hitachi Metals Ltd

Inventors

• Ishikawa Hiroshi
• Hirano Kouki
• Yasuda Hiroki

Classifications

• G02B6/4214 Primary

  the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence) · CPC title

• H05K3/0026

  by laser ablation · CPC title

• G02B6/4283

  with electrical insulation means · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H10F55/20

  wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers · CPC title