Curable and cured adhesive compositions

US9528035B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9528035-B2
Application numberUS-201013389947-A
CountryUS
Kind codeB2
Filing dateAug 20, 2010
Priority dateSep 11, 2009
Publication dateDec 27, 2016
Grant dateDec 27, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, d) a toughening agent, and e) an oil displacing agent. The cured adhesive compositions can be used as structural adhesives.

First claim

Opening claim text (preview).

I claim: 1. A curable adhesive composition having a first part and a second part, the curable adhesive composition comprising: a) an epoxy resin, wherein the epoxy resin is in the first part of the curable adhesive composition; b) a curing agent having at least two groups of formula —NR 1 H where R 1 is selected from hydrogen, alkyl, aryl, or alkylaryl, wherein the curing agent is in the second part of the curable adhesive composition; c) a reactive liquid modifier that is in the first part of the curable adhesive composition, the reactive liquid modifier being of Formula (I) R 2 (CO)CH 2 (CO)O—R 3 —O(CO)CH 2 (CO)R 2    (I)  wherein R 2 is hydrogen or an alkyl; and R 3 is of formula —[(CH 2 ) n O] m —(CH 2 ) n —, wherein R 3 has greater than 20 carbon atoms; n is an integer of 2 to 4; and m is an integer greater than or equal to 5; and d) a toughening agent, wherein the toughening agent is in the first part, in the second part, or in both the first part and the second part of the curable adhesive composition; e) an oil displacing agent that is in the first part, in the second part, or in both the first part and the second part of the curable adhesive composition, wherein the oil displacing agent is soluble in the curable adhesive composition, has a surface tension in a range of 15 to 32 dynes/cm, and is not selected from a glycidyl ether; and f) fibrillated organic fibers comprising polyolefin fibers or aramid fibers. 2. The curable adhesive composition of claim 1 , wherein the oil displacing agent has a solubility parameter in the range of 6 to 12 cal 0.5 /cm 1.5 . 3. The curable adhesive composition of claim 1 , wherein the oil displacing agent is selected from a glycidyl ester, cyclic terpene, cyclic terpene oxide, mono-ester, di-ester, tri-ester, trialkyl phosphate, epoxy alkane, alkyl methacrylate, vinyl alkyl esters, or combination thereof. 4. The curable adhesive composition of claim 1 , wherein the variable n is equal to 4. 5. The curable adhesive composition of claim 1 , wherein R 3 has at least 30 carbon atoms. 6. The curable adhesive composition of claim 1 , wherein the epoxy resin has comprises a glycidyl ether having two to four glycidyl groups.

Assignees

Inventors

Classifications

  • Polyalkylene oxides · CPC title

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Polyalkylene oxides · CPC title

  • Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20 · CPC title

  • Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

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What does patent US9528035B2 cover?
Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, d) a toughening agent, and e) an oil displacing agent. The cured adhesive compositions can be used as structural adhesives.
Who is the assignee on this patent?
Campbell Christopher J, 3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).