Rapid curing epoxy repair composition and use thereof
US-2024360306-A1 · Oct 31, 2024 · US
Thermosetting resin composition
US9527996B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9527996-B2 |
| Application number | US-201414779787-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 24, 2014 |
| Priority date | Mar 26, 2013 |
| Publication date | Dec 27, 2016 |
| Grant date | Dec 27, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The invention provides a thermosetting resin composition that demonstrates superior peel strength while retaining excellent heat resistance and tensile shear adhesion strength. The thermosetting resin composition comprises: an epoxy resin A containing an epoxy group and a thermoplastic resin B containing a functional group f having reactivity with an epoxy group, the thermoplastic resin B being obtained by modifying a thermoplastic resin b1 containing an unsaturated bond with a nitrone b2 containing the functional group f, and the content of the nitrone b2 relative to the unsaturated bonds being not less than 0.5 mol % and less than 10 mol %, and the content of the thermoplastic resin B being from 10 to 50 parts by mass per 100 parts by mass of the epoxy resin A.
First claim
Opening claim text (preview).
What is claimed is: 1. A thermosetting resin composition comprising: an epoxy resin A containing two or more epoxy groups per molecule; and a thermoplastic resin B containing a functional group f having reactivity with the epoxy groups, the thermoplastic resin B being obtained by modifying a thermoplastic resin b1 containing an unsaturated bond with a nitrone b2 containing the functional group f, and a content of the nitrone b2 relative to the unsaturated bonds being not less than 0.5 mol % and less than 10 mol %, and a content of the thermoplastic resin B being from 10 to 50 parts by mass per 100 parts by mass of the epoxy resin A. 2. The thermosetting resin composition according to claim 1 , wherein the functional group f is a nitrogen-containing group having reactivity with an epoxy group. 3. The thermosetting resin composition according to claim 2 , wherein the functional group f which is the nitrogen-containing group is an imidazole residue. 4. The thermosetting resin composition according to claim 1 , wherein the thermoplastic resin b1 is a diene rubber component. 5. The thermosetting resin composition according to claim 1 , further comprising a curing agent C containing a functional group having reactivity with the epoxy groups. 6. The thermosetting resin composition according to claim 2 , wherein the thermoplastic resin b1 is a diene rubber component. 7. The thermosetting resin composition according to claim 3 , wherein the thermoplastic resin b1 is a diene rubber component. 8. The thermosetting resin composition according to claim 2 , further comprising a curing agent C containing a functional group having reactivity with the epoxy groups. 9. The thermosetting resin composition according to claim 3 , further comprising a curing agent C containing a functional group having reactivity with the epoxy groups. 10. The thermosetting resin composition according to claim 4 , further comprising a curing agent C containing a functional group having reactivity with the epoxy groups. 11. The thermosetting resin composition according to claim 6 , further comprising a curing agent C containing a functional group having reactivity with the epoxy groups. 12. The thermosetting resin composition according to claim 7 , further comprising a curing agent C containing a functional group having reactivity with an epoxy group.
Assignees
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Classifications
characterised by the curing agents used · CPC title
Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title
together with other curing agents · CPC title
Thermoplastic elastomer · CPC title
- C08L63/00Primary
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
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Frequently asked questions
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- What does patent US9527996B2 cover?
- The invention provides a thermosetting resin composition that demonstrates superior peel strength while retaining excellent heat resistance and tensile shear adhesion strength. The thermosetting resin composition comprises: an epoxy resin A containing an epoxy group and a thermoplastic resin B containing a functional group f having reactivity with an epoxy group, the thermoplastic resin B being…
- Who is the assignee on this patent?
- Yokohama Rubber Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).