Three dimensional (3D) printing of epoxy, hardener, and parts of an object to be assembled later

US9527241B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9527241-B2
Application numberUS-201314136563-A
CountryUS
Kind codeB2
Filing dateDec 20, 2013
Priority dateDec 20, 2013
Publication dateDec 27, 2016
Grant dateDec 27, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A three dimensional (3D) printer and method for dispensing a material to form a 3D substructure and for dispensing an adhesive onto the 3D substructure. The adhesive printed onto the 3D substructure may be used to attach the 3D substructure to another substructure such as a conventionally formed substructure or another 3D printed substructure. Printing the adhesive using the 3D printer during the same 3D manufacturing process used to print the 3D substructure may improve precision of the location at which the adhesive is dispensed, thereby improving the quality of superstructure created by joining the substructures. An embodiment of the present teachings may decrease the overall time and cost to attach substructures.

First claim

Opening claim text (preview).

The invention claimed is: 1. A system for forming a structure, the system comprising: a three dimensional (3D) printer, comprising: a first reservoir comprising a polymer; a second reservoir comprising an adhesive; a nozzle configured to dispense the polymer onto a platform to form a 3D substructure; a nozzle configured to dispense the adhesive onto the 3D substructure; and a film covering configured to cover the adhesive subsequent to printing the adhesive to reduce an exposure of the adhesive to air, thereby slowing a cure rate of the adhesive. 2. The system of claim 1 , further comprising: a first printhead comprising the first reservoir and the nozzle configured to dispense the polymer; and a second printhead comprising the second reservoir and the nozzle configured to dispense the adhesive. 3. The system of claim 1 , wherein the adhesive comprises one of an epoxy resin component and an epoxy hardener component. 4. The system of claim 1 , further comprising: a third reservoir comprising the film covering, wherein the film covering is a liquid viscous material within the third reservoir; and a nozzle configured to dispense the film covering. 5. The system of claim 1 , further comprising a printhead comprising the first reservoir and the second reservoir, wherein the adhesive comprises at least one of a polyurethane, an acrylic, a cyanoacrylate, a thermoplastic, and a thermoset. 6. The system of claim 1 , wherein the film covering is a plurality of pre-formed solid film coverings, and the system further comprises a tape and reel assembly comprising a supply reel, a take-up reel, and a tape assembly, wherein the tape assembly comprises the plurality of pre-formed solid film coverings, and the system is further configured to dispense the plurality of pre-formed solid film coverings onto the adhesive subsequent to printing the adhesive to reduce an exposure of the adhesive to air, thus slowing a cure rate of the adhesive. 7. The system of claim 6 , wherein each pre-formed solid film covering of the plurality of pre-formed solid film coverings comprises a tab portion configured to assist removal of the pre-formed solid film covering from the adhesive.

Assignees

Inventors

Classifications

  • B33Y10/00Primary

    Processes of additive manufacturing · CPC title

  • Operations & Transport · mapped topic

  • B41F17/00Primary

    Printing apparatus or machines of special types or for particular purposes, not otherwise provided for · CPC title

  • using individual droplets, e.g. from jetting heads · CPC title

  • B29C64/106Primary

    using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

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What does patent US9527241B2 cover?
A three dimensional (3D) printer and method for dispensing a material to form a 3D substructure and for dispensing an adhesive onto the 3D substructure. The adhesive printed onto the 3D substructure may be used to attach the 3D substructure to another substructure such as a conventionally formed substructure or another 3D printed substructure. Printing the adhesive using the 3D printer during t…
Who is the assignee on this patent?
Xerox Corp
What technology area does this patent fall under?
Primary CPC classification B33Y10/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).