Method and apparatus to apply material to a surface

Patent metadata

Field	Value
Publication number	US-9527107-B2
Application number	US-201313739663-A
Country	US
Kind code	B2
Filing date	Jan 11, 2013
Priority date	Jan 11, 2013
Publication date	Dec 27, 2016
Grant date	Dec 27, 2016

Abstract

An apparatus for particle deposition is disclosed. The apparatus includes a housing configured to couple to a work piece to form a chamber. A nozzle directs a working gas into the chamber to deposit a particle entrained in the working gas at the work piece. The nozzle may be coupled to a flow channel within the chamber that directs the working gas through the nozzle. The coupling between the housing and the work piece may be a slidable coupling.

First claim

What is claimed is:

1. An apparatus, comprising:
a housing;
an air-bearing surface of the housing configured to couple the housing to a surface of a work piece to form a chamber;
a gas inlet of the air-bearing surface configured to supply a pressurizing gas between the air-bearing surface and the surface of the work piece, wherein the pressurizing gas flows along the air-bearing surface into the chamber;
a manifold disposed in the chamber configured to receive a working gas and direct the working gas onto the work piece and having a nozzle directed at the work piece;
a source of particles within the manifold configured to introduce a particle into the working gas, wherein the working gas entrains the particle from the source and conveys the particle through the nozzle to impinge onto the work piece in order to deposit the particle at the surface of the work piece; and
a pump for evacuating the chamber to produce a partial vacuum in the chamber, wherein the pump controls a negative pressure in the chamber to control a differential pressure between a pressure zone at the air-bearing surface and a pressure zone in the chamber to maintain a separation distance between the surface of the workpiece and the air-bearing surface of the housing.

2. The apparatus of claim 1 , wherein the air-bearing surface is further configured to couple the housing to the work piece to provide the partial vacuum in the chamber.

3. The apparatus of claim 1 , wherein the supplying the pressurizing gas between the air-bearing surface and the surface of the work piece produces a positive pressure zone and evacuating an exhaust gas from the chamber produces a negative pressure zone.

4. The apparatus of claim 1 , wherein the housing is further configured to slidably couple to the work piece to form the chamber via a cushion of pressurized gas between the air-bearing surface and the surface of the work piece.

5. The apparatus of claim 1 , wherein the source of particles further comprising an evaporated source configured to control a particle introduction rate into the working gas.

6. The apparatus of claim 5 , wherein the source of particles further comprises at least one of a heating element; a crucible; an evaporant material; a Knudson cell; a gas containing the particle, a material in the presence of a plasma that emits the particle in the presence of the plasma; a reactive working gas that interacts chemically with the surface of the work piece to facilitate particle deposition and a chemical source undergoing a chemical reaction to emit the particle.

7. The apparatus of claim 1 , wherein the air-bearing surface further comprises a pressurizing gas cavity that receives the pressurized gas from a pressurizing gas inlet.

8. The apparatus of claim 1 , wherein the pressurizing gas cavity extends circumferentially along the air-bearing surface.

9. The apparatus of claim 1 , further comprising a heating element inside the manifold for heating the source of particles.

10. The apparatus of claim 1 , wherein the source of particles further comprises a first source of particles within the manifold and a second source of particles within the manifold, wherein the working gas entrains particles from both the first source of particles and the second source of particles and conveys the particles through the nozzle and wherein a particle introduction rate of the first source of particles is independent from the particle introduction rate of the second source of particles.

11. The apparatus of claim 10 , wherein the first source of particles is in a first channel of the manifold and is heated by a first heating element and the second source of particles is in a second channel of the manifold and is heating by a second heating element.

12. The apparatus of claim 11 , wherein the first channel and second channel recombine at the nozzle to create a selected composition at the nozzle.

13. A particle deposition device, comprising:
a work piece;
a housing configured to couple to the work piece to form a chamber;
an air-bearing surface of the housing configured to supply a pressurizing gas between the air-bearing surface and a surface of the work piece to couple the housing to the work piece, wherein the pressurizing gas flows along the air-bearing surface into the chamber;
a manifold within the chamber configured to receive a working gas and direct the working gas through a nozzle of the manifold onto the work piece;
a source of particles within the manifold configured to introduce a particle into the working gas, wherein the working gas entrains the particle from the source of particles and conveys the particle through the nozzle to impinge onto the work piece in order to deposit the particle at the surface of the work piece; and
a pump for evacuating the chamber to produce a partial vacuum in the chamber, wherein the pump controls a negative pressure in the chamber to control a differential pressure between a pressure zone at the air-bearing surface and a negative pressure zone in the chamber to maintain a separation distance between the surface of the workpiece and the air-bearing surface of the housing.

14. The apparatus of claim 13 , wherein the pressurizing gas provides a slidable coupling between the housing to the work piece.

15. The apparatus of claim 13 , wherein the source of particles further comprises at least two sources of particles and a rate of particle introduction into the flow of the at least two sources of particles is independently controllable.

16. A particle deposition device, comprising:
a housing configured to couple to a work piece to form a chamber;
a coupling device on the housing configured to maintain a slidable coupling between the housing and the work piece, wherein the coupling device includes an air-bearing surface configured to supply a pressurizing gas between the air-bearing surface and a surface of the work piece to couple the housing to the work piece, wherein the pressurizing gas flows along the air-bearing surface into the chamber;
a manifold within the chamber configured to receive a working gas and to direct the working gas through a nozzle of the manifold onto a surface of the work piece that forms the chamber;
a source of particles within the manifold configured to introduce a particle into the working gas, wherein the working gas entrains the particle from the source of particles and conveys the particle through the nozzle of the manifold to impinge onto a surface of the work piece in order to deposit the particle at the surface; and
a pump for evacuating an exhaust gas from the chamber to produce a partial vacuum in the chamber, wherein the pump controls a negative pressure in the chamber to control a differential pressure between a pressure zone at the air-bearing surface and a pressure zone in the chamber to maintain a separation distance between the surface of the workpiece and the air-bearing surface of the housing.

17. The particle deposition device of claim 16 , wherein the coupling device is further configured to maintain the partial vacuum in the chamber.

18. The particle deposition device of claim 16 , wherein supplying the pressurizing gas between the air-bearing surface and the surface of the work piece produces a positive pressure zone and evacuating the exhaust gas from the chamber produces a negative pressure zone.

19. The particle deposition device 16 , wherein the manifold further comprises at least two separate flow channels for directing the working gas to the nozzle.

Assignees

• IBM

Inventors

• Van Kessel Theodore G
• Wacaser Brent A

Classifications

• C23C16/45585

  Compression of gas before it reaches the substrate · CPC title

• C23C14/24

  Vacuum evaporation · CPC title

• C23C14/50

  Substrate holders · CPC title

• C23C14/04

  Coating on selected surface areas, e.g. using masks · CPC title

• C23C16/458

  characterised by the method used for supporting substrates in the reaction chamber · CPC title