Process for manufacturing a printed circuit board
US-2015366071-A1 · Dec 17, 2015 · US
Printed circuit board method
US9526178B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9526178-B2 |
| Application number | US-201414519677-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 21, 2014 |
| Priority date | Aug 15, 2013 |
| Publication date | Dec 20, 2016 |
| Grant date | Dec 20, 2016 |
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Abstract
Official abstract text for this publication.
A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit to move along the drill hole formed in the first backdrilling toward the target signal layer; and when the backdrill bit is in contact with the conductive layer, completing a second backdrilling with a second preset depth starting from the conductive layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board (PCB) backdrilling method, wherein a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, the conductive layer is connected to the PHT, and the target signal layer is a signal layer corresponding to a current backdrilling task, and the method comprises; performing a first backdrilling on the PTH with a first preset depth starti…
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Inventors
Classifications
Cross-Sectional Technologies · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H05K3/0047Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9526178B2 cover?
- A printed circuit board (PCB) backdrilling method is disclosed, where a conductive layer is disposed between a surface of a PCB on an intended-for-backdrilling side of a plated through hole (PTH) and a target signal layer of the PCB, and the method includes: performing a first backdrilling on the PTH with a first preset depth starting from the surface of the PCB; controlling the backdrill bit t…
- Who is the assignee on this patent?
- Huawei Tech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/0047. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).