Electronic device including screen
US-2015365508-A1 · Dec 17, 2015 · US
Board assembly
US9526162B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9526162-B2 |
| Application number | US-201314104266-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2013 |
| Priority date | Apr 10, 2013 |
| Publication date | Dec 20, 2016 |
| Grant date | Dec 20, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the board assembly may contribute to the reduction of the thickness of an electronic device while being stacked with a battery. Further, the entire socket is exposed to the outside of the shield member, the storage medium may be easily removed.
First claim
Opening claim text (preview).
What is claimed is: 1. A board assembly comprising: a circuit board; a shield member coupled to the circuit board having a major surface directed toward the circuit board and having a plurality of partitions arranged on an inner surface of the shield member to separate the circuit board into a plurality of regions to block electromagnetic interference among integrated circuit chips mounted on the circuit board; and a socket for a storage medium mounted on the circuit board,…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H04M1/0277Primary
Electricity · mapped topic
- H05K1/0216Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9526162B2 cover?
- A board assembly includes: a circuit board; a shield member coupled to the circuit board to face the circuit board; and at least one socket for a storage medium which is mounted on the circuit board. The shield member includes an opening that exposes the entirety of the socket to the outside. The board assembly forms an opening in a dual recess structure to accommodate the socket. Thus, the boa…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H04M1/0277. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).