Package formation methods including coupling a molded routing layer to an integrated routing layer
US-2024355697-A1 · Oct 24, 2024 · US
Method for fabricating package structure
US9524944B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9524944-B2 |
| Application number | US-201615143691-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 2, 2016 |
| Priority date | May 1, 2013 |
| Publication date | Dec 20, 2016 |
| Grant date | Dec 20, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for fabricating a package structure, comprising the steps of: providing a substrate comprising: a body; a plurality of conductive pads formed on the body; and a surface passivation layer formed on the body and the conductive pads and having a plurality of openings for exposing the conductive pads; forming a second passivation layer on the surface passivation layer and the conductive pads; forming in the second passivation layer a pluralit…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9524944B2 cover?
- A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality o…
- Who is the assignee on this patent?
- Siliconware Precision Industries Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W74/129. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).