Substrate transfer antechamber mechanism

Patent metadata

Field	Value
Publication number	US-9524895-B2
Application number	US-201314647685-A
Country	US
Kind code	B2
Filing date	Oct 29, 2013
Priority date	Dec 4, 2012
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

There is provided a substrate transfer antechamber mechanism for a compact manufacturing apparatus that produces various types of devices in small volume using a small-diameter processing substrate at low cost. A container placement table, on which a wafer transfer container housing a semiconductor wafer is placed, is provided on an upper surface of an apparatus antechamber for a compact semiconductor manufacturing apparatus, and the apparatus antechamber includes therein a wafer elevating mechanism and a horizontal transfer mechanism. The wafer elevating mechanism moves down while holding from below a delivery bottom of the wafer transfer container, on which the semiconductor wafer remains placed, to transfer the semiconductor wafer into the apparatus antechamber. The horizontal transfer mechanism transfers the semiconductor wafer into a processing chamber using a transfer arm that receives the semiconductor wafer from the delivery bottom and extends.

First claim

The invention claimed is:

1. A substrate transfer antechamber mechanism for a manufacturing apparatus including a processing chamber that performs processing of a processing substrate, and an apparatus antechamber that transfers the processing substrate into and out of the processing chamber, the mechanism comprising:
a container placement table provided on an upper surface of a casing of the apparatus antechamber onto which a substrate transfer container is detachably settable from an outside of the casing, the substrate transfer container having a delivery bottom onto which the processing substrate is disposed on;
an inlet provided to the casing of the apparatus antechamber, through which the delivery bottom of the substrate transfer container set on the container placement table is transferred into the apparatus antechamber;
a substrate elevating mechanism provided in the apparatus antechamber, which moves down while being held from below the delivery bottom of the substrate transfer container, on which the processing substrate remains placed, to transfer the processing substrate into the apparatus antechamber through the inlet; and
a horizontal transfer mechanism provided in the apparatus antechamber to transfer the processing substrate into the processing chamber using a transfer arm that receives the processing substrate from the delivery bottom and extends in a horizontal direction, wherein a base of the transfer arm is disposed inside the casing of the apparatus antechamber.

2. The substrate transfer antechamber mechanism according to claim 1 , wherein the processing chamber is separable from the apparatus antechamber.

3. The substrate transfer antechamber mechanism according to claim 1 , further comprising a transfer arm elevating mechanism provided in the apparatus antechamber to move the horizontal transfer mechanism down to place the processing substrate on a substrate placement table in the processing chamber.

4. The substrate transfer antechamber mechanism according to claim 1 , wherein the processing substrate is a wafer having a diameter of 20 millimeters or less.

5. The substrate transfer antechamber mechanism according to claim 1 , wherein after the substrate elevating mechanism moves down the delivery bottom of the substrate transfer container into the apparatus antechamber, the substrate transfer antechamber mechanism operates:
a first horizontal rectilinear motion to insert a hand portion of the transfer arm to a clearance under a bottom surface of the processing substrate placed on the delivery bottom,
a first vertical rectilinear motion to hold the processing substrate by the hand portion by contacting the hand portion to the bottom surface of the processing substrate and separating the processing substrate from the delivery bottom, after the first horizontal rectilinear motion,
a second horizontal rectilinear motion to transfer the processing substrate from the apparatus antechamber into the processing chamber by extending the transfer arm without rotating, after the first vertical rectilinear motion, and
a second vertical rectilinear motion to place the processing substrate onto a substrate placement table in the processing chamber, after the second horizontal rectilinear motion.

6. The substrate transfer antechamber mechanism according to claim 1 , wherein;
the substrate transfer container is configured so as to house one processing substrate,
the processing chamber is configured so as to process one processing substrate per one processing, and
the delivery bottom of the substrate transfer container and a substrate placement table of the processing chamber is allocated so that a translation of the processing substrate between above the delivery bottom and above the substrate placement table is executed by reciprocation of the transfer arm.

7. The substrate transfer antechamber mechanism according to claim 1 , wherein;
the transfer arm of the horizontal transfer mechanism comprises plurality of slide arms stacked on each other, and
the plurality of slide arms move relatively to extend the transfer arm.

Assignees

• Nat Inst Advanced Ind Science & Tech

Inventors

• Hara Shiro
• Maekawa Hitoshi

Classifications

• H10P72/3411

  involving loading and unloading of wafers · CPC title

• H10P72/3406 Primary

  involving removal of lid, door or cover · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title

• H10P72/3304

  characterised by movements or sequence of movements of transfer devices · CPC title

• H10P72/3302 Primary

  Mechanical parts of transfer devices · CPC title