Disk drive suspension assembly having a partially flangeless load point dimple

US9524739B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9524739-B2
Application numberUS-201414760426-A
CountryUS
Kind codeB2
Filing dateJul 15, 2014
Priority dateJul 15, 2013
Publication dateDec 20, 2016
Grant dateDec 20, 2016

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Various embodiments concern a suspension assembly of a disk drive. The suspension assembly includes a load beam comprising a major planar area formed from a substrate. The load beam further comprises a window in the substrate, a dimple formed from the substrate, and a flange. The flange is a region of the major planar area that extends partially around the dimple but does not extend along an edge of the dimple. The edge of the dimple is adjacent to the window. The dimple is in contact with the flexure. A HAMR block or other element can extend through the window. The lack of a full flange can minimize the necessary clearance between the dimple and the HAMR block or other element and thereby allow the window to be enlarged to accommodate the HAMR block or other element.

First claim

Opening claim text (preview).

We claim: 1. A suspension assembly of a disk drive, the suspension assembly comprising: a flexure; and a load beam, the load beam comprising a planar area, a window in the planar area, and a dimple having a protruding surface adjacent to the window, the dimple having a truncated portion defining an edge of the window, the dimple in contact with the flexure and configured to transfer a force to the flexure while allowing the flexure to move relative to the load beam.…

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What does patent US9524739B2 cover?
Various embodiments concern a suspension assembly of a disk drive. The suspension assembly includes a load beam comprising a major planar area formed from a substrate. The load beam further comprises a window in the substrate, a dimple formed from the substrate, and a flange. The flange is a region of the major planar area that extends partially around the dimple but does not extend along an ed…
Who is the assignee on this patent?
Hutchinson Technology
What technology area does this patent fall under?
Primary CPC classification G11B5/4833. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).