Sensor having thermal gradients

US9523619B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9523619-B2
Application numberUS-201414162036-A
CountryUS
Kind codeB2
Filing dateJan 23, 2014
Priority dateSep 17, 2013
Publication dateDec 20, 2016
Grant dateDec 20, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.

First claim

Opening claim text (preview).

What is claimed is: 1. A system, comprising: a sensor assembly, including: a housing; a first header and a second header coupled to the housing; a first port extending from the first header and through an end portion of the housing, the first port configured for communication with a first pressure, wherein the first pressure is characterized by a dynamic pressure having a first temperature; a second port extending from the second header and through a plurality of channels in communication with a plurality of respective openings distributed around a side portion of the housing, the second port configured for communication with atmospheric pressure, wherein the atmospheric pressure is characterized by a static pressure having a second temperature that differs from the first temperature; a first transducer thermally coupled to the first header and in communication with the first pressure by the first port, wherein the first transducer is configured to measure the first pressure to generate a first pressure signal; a second transducer thermally coupled to the second header and in communication with the second pressure port, wherein the second transducer is configured to measure the atmospheric pressure to generate a second pressure signal; and wherein the housing comprises a one-piece thermally conductive metal material disposed around and forming the first port and the second port, and wherein the first transducer and the second transducer are positioned in the housing such that a third temperature of the first transducer is about equivalent to a fourth temperature of the second transducer during operation of the sensor assembly. 2. The system of claim 1 , wherein the first transducer and the second transducer are about laterally equidistant from a front surface of the housing. 3. The system of claim 1 , wherein the first transducer and the second transducer are symmetrically positioned relative to a longitudinal axis of the sensor assembly. 4. The system of claim 1 , wherein the housing is configured to secure the sensor to another structure. 5. The system of claim 1 , wherein the sensor assembly further includes: a third header coupled to the housing; a third transducer coupled to the third header, wherein the third transducer is configured to measure a third pressure to generate a third pressure signal; a fourth transducer coupled to the third header, wherein the fourth transducer is configured to measure a fourth pressure to determine a fourth pressure signal; and wherein each of the first transducer, the second transducer, the third transducer and the fourth transducer has about an equivalent temperature. 6. The system of claim 5 , wherein the sensor assembly further includes: a third port coupled to the third transducer, wherein the housing is disposed around and defines the third port; a fourth port coupled to the second transducer, wherein the housing is disposed around and defines the fourth port; wherein the third transducer is further configured to: receive, from the third port, a third pressure; and wherein the fourth transducer is further configured to: receive, from the fourth port, a fourth pressure. 7. The system of claim 6 , wherein the third port and the fourth port are the same port. 8. The system of claim 1 , wherein the sensor assembly further includes: an electronic component operationally coupled to the first transducer and the second transducer, wherein the electronic component is configured to: receive, from the first transducer, the first pressure signal; receive, from the second transducer, the second pressure signal; and determine a first differential pressure signal using the first pressure signal and the second pressure signal.

Assignees

Inventors

Classifications

  • G01L13/025Primary

    using diaphragms · CPC title

  • G01L9/06Primary

    of piezo-resistive devices · CPC title

  • Means for compensating for effects of changes of temperature {, i.e. other than electric compensation} · CPC title

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What does patent US9523619B2 cover?
This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; …
Who is the assignee on this patent?
Kulite Semiconductor Products Inc
What technology area does this patent fall under?
Primary CPC classification G01L13/025. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).