Pipette tip for electroporation device

Patent metadata

Field	Value
Publication number	US-9523071-B2
Application number	US-200913060682-A
Country	US
Kind code	B2
Filing date	Apr 15, 2009
Priority date	Apr 15, 2008
Publication date	Dec 20, 2016
Grant date	Dec 20, 2016

Abstract

Provided herein is a pipette tip ( 600 ) for electroporation including an outer surface, a void ( 611 ) located within the outer surface, and a conductor ( 622 ) located at least partially on or within the outer surface, in electrical communication with at least a portion of the outer surface and the void. Further provided herein is a pipette tip for electroporation including a body, a connector ( 620 ), and an elongated part ( 630 ). The connector is located at the distal end of the body and further includes at least one connecting post, a connecting part in mechanical communication with the connector, and a conductor located at least partially on or within the connector, wherein the conductor surrounds at least a portion of the connecting post. The elongated part also has a void and is located at the distal end of the connector. The void of the body, connector, and elongated part are in fluid communication.

First claim

What is claimed is:

1. An electroporation device comprising:
a pipette tip including an outer surface and a void located within the outer surface, wherein the pipette tip has proximal and distal ends, wherein the pipette tip comprises:
a combining part, wherein the combining part is located at the proximal end of the pipette tip and is configured to removably connect to a pipette;
an elongated part located at the distal end of the pipette tip;
a connecting part including at least two connecting posts located between the combining part and the elongated part along the pipette tip; and
a conductor, wherein the conductor is located at least partially within the combining part and is in electrical communication with at least a portion of the outer surface and the void through a gap between the connecting posts.

2. The pipette tip of claim 1 wherein the conductor is in fluid communication with the void.

3. The pipette tip of claim 1 wherein the conductor is ring-shaped.

4. The pipette tip of claim 1 where in the conductor includes a body portion and a surface.

5. The pipette tip of claim 4 wherein the body portion includes a conductive material.

6. The pipette tip of claim 5 wherein the conductive material is selected from at least one of copper, brass, nickel, gold, silver, or aluminum.

7. The pipette tip of claim 4 wherein the body portion is an injection molded conductor.

8. The pipette tip of claim 7 wherein the injection molded conductor includes at least one of plastic or conductive polymer.

9. The pipette tip of claim 4 wherein the surface is plated with at least one of brass, copper, aluminum, nickel, gold, or silver.

10. The pipette tip of claim 1 wherein the connector part is funnel shaped.

11. The pipette tip of claim 1 comprising three connecting posts.

Assignees

• Chang Jun-Keun
• Cho Keun-Chang
• Chung Chan-Il
• Jung Neon-Cheol
• Huh Seung Gin
• Life Technologies Corp

Inventors

• Chang Jun-Keun
• Cho Keun-Chang
• Chung Chan-Il
• Jung Neon-Cheol
• Huh Seung Gin

Classifications

• C12M35/02 Primary

  Electrical or electromagnetic means, e.g. for electroporation or for cell fusion · CPC title

• B01L3/0237

  Details of electronic control, e.g. relating to user interface · CPC title

• C12M33/04

  by injection or suction, e.g. using pipettes, syringes, needles (pipettes in general B01L3/02) · CPC title

• B01L2300/16

  Surface properties and coatings · CPC title