Electronic component mounting method

Patent metadata

Field	Value
Publication number	US-9521792-B2
Application number	US-201113813794-A
Country	US
Kind code	B2
Filing date	Jun 21, 2011
Priority date	Aug 3, 2010
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

First claim

The invention claimed is:

1. An electronic component mounting method using an electronic component mounting apparatus comprising:
a substrate transport mechanism that comprises a first substrate transport lane and a second substrate transport lane arranged in parallel to a substrate transport direction and that transports substrates on which electronic components are to be mounted;
a component supply unit that is disposed on a side of the substrate transport mechanism and supplies the electronic components; and
a tray feeder that comprises a first tray supply mechanism and a second tray supply mechanism arranged in parallel, each having a function of retrieving trays from a tray housing unit that is disposed in the component supply unit and houses the trays storing therein the electronic components in a plane, and transferring the trays to a component pickup position;
a component mounting mechanism comprising: a mounting head that picks up and holds the electronic components from the trays transferred to the component pickup position; and a head transfer mechanism that transfers the mounting head; and
a controller that controls the substrate transport mechanism, the component supply unit, and the component mounting mechanism,
whereby the electronic components are picked up from the component supply unit by the mounting head, and mounted on the substrates transported by the substrate transport mechanism,
said component mounting method comprising:
transporting substrates of different substrate types as a first substrate by the first substrate transport lane and a second substrate transport lane in a first mode, and transporting substrates of a same substrate type as the first substrate by the first substrate transport lane and the second substrate transport lane in a second mode;
allowing both of the first tray supply mechanism and the second tray supply mechanism to hold the trays storing therein the electronic components to be mounted on the substrates;
switching, in the second mode, during a component mounting process of picking up the electronic components from one of the first tray supply mechanism and the second tray supply mechanism and mounting the electronic components on the substrates carried in each of the first substrate transport lane and the second substrate transport lane and if shortage of the components occurs in the one tray supply mechanism, a target for picking up the electronic components from the one tray supply mechanism to the other tray supply mechanism;
outputting, in the first mode, a scheduled production number completion signal or a scheduled production number completion estimate signal for one of the different substrate types;
executing, in the first mode, by the controller in response to the scheduled production number completion signal or a scheduled production number completion estimate signal, a use stop setting for one of the first tray supply mechanism and the second tray supply mechanism corresponding to the one of the different substrate types to which the scheduled production number completion signal or the scheduled production number completion estimate signal is outputted while continuing a component mounting operation by the other of the first tray supply mechanism and the second tray supply mechanism; and
executing, in the second mode, by the controller in response to occurrence of the shortage of the components in the one of the first tray supply mechanism and the second tray supply mechanism, a use stop setting for the one of the first tray supply mechanism and the second tray supply mechanism corresponding to the same substrate type in which the shortage of the components occurs while continuing a component mounting operation by the other of the first tray supply mechanism and the second tray supply mechanism; and
executing a preceding setup change operation for producing a subsequent substrate type for the tray supply mechanism that has been set to the use stop setting while continuing the component mounting operation by allowing the controller to prohibit an access of the mounting head to the tray supply mechanism having been set to the use stop setting, and to permit an operation access of an operator to the tray housing unit of the tray supply mechanism.

2. The electronic component mounting method according to claim 1 ,
wherein the controller is capable of enabling the use stop setting based on the scheduled production number completion estimate signal issued by a scheduled production number completion estimating function provided in the electronic component mounting apparatus, or the scheduled production number completion estimate signal received from an external device.

3. The electronic component mounting method according to claim 1 ,
wherein the controller is capable of enabling the use stop setting based on the scheduled number completion signal issued by a production number counting function provided in the electronic component mounting apparatus.

4. The electronic component mounting method according to claim 1 ,
wherein the controller is capable of enabling the use stop setting based on an operation input of the operator.

5. The electronic component mounting method according to claim 1 , further comprising
exclusively picking up the electronic components from the first tray feeder and mounting the electronic components picked up from the first tray feeder on the substrates carried in the first substrate transport and exclusively picking up the electronic components from the second tray feeder and mounting the electronic components picked up from the second tray feeder on the substrates carried in the second substrate transport until shortage of the components occurs in either one of the first and second tray feeders.

Assignees

• Kawaguchi Teppei
• Noda Takahiro
• Yamazaki Takuya
• Chikuma Toru
• Hattori Yoshiyuki
• Panasonic Ip Man Co Ltd

Inventors

• Kawaguchi Teppei
• Noda Takahiro
• Yamazaki Takuya
• Chikuma Toru
• Hattori Yoshiyuki

Classifications

• H05K13/02 Primary

  Feeding of components · CPC title

• H05K13/0434 Primary

  with containers · CPC title

• Y10T29/4913

  Assembling to base an electrical component, e.g., capacitor, etc. · CPC title

• H05K13/0452

  Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K13/0406, H05K13/041 take precedence) · CPC title

• Y10T29/53174

  Means to fasten electrical component to wiring board, base, or substrate · CPC title