Microphone module and electronic device having the same

Patent metadata

Field	Value
Publication number	US-9521475-B2
Application number	US-201414492723-A
Country	US
Kind code	B2
Filing date	Sep 22, 2014
Priority date	Feb 26, 2014
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

An electronic device includes a housing having a top wall, and a microphone module mounted in the housing. The microphone module includes a mounting seat having two oppositely spaced-apart upright suspension surfaces extending transversely from the top wall. A buffer member includes a main body disposed between and spaced apart from the suspension surfaces, and two suspension bumps protruding from the main body toward and abutting respectively and tightly against the suspension surfaces. The main body has an inner portion defining an accommodating space. A microphone body is disposed in the accommodating space.

First claim

What is claimed is:

1. A microphone module comprising:
a mounting seat including two oppositely spaced-apart upright suspension surfaces;
a buffer member including a main body disposed between and spaced apart from said suspension surfaces, and two suspension bumps protruding from said main body toward and abutting respectively and tightly against said suspension surfaces, said main body having an inner portion defining an accommodating space; and
a microphone body disposed in said accommodating space.

2. The microphone module as claimed in claim 1 , wherein said mounting seat further includes a first abutment face connected between said suspension surfaces and spaced apart from said main body, said buffer member further including at least one first bump protruding from said main body toward and abutting against said first abutment face.

3. The microphone module as claimed in claim 1 , wherein said mounting seat further includes two spaced-apart ribs disposed on one side of and spaced apart from said main body said buffer member further including an elongated bump protruding from said main body toward and abutting against said ribs.

4. The microphone module as claimed in claim 1 , wherein said buffer member further includes a tubular portion extending from said main body away from said accommodating space, said tubular portion communicating said accommodating space with an external environment and being transverse with an arrangement direction of said suspension bumps.

5. The microphone module as claimed in claim 1 , wherein said main body has an upright flat area on one side thereof, and an inclined area extending oppositely, downwardly, and inclinedly from a bottom end of said flat area.

6. The microphone module as claimed in claim 1 , wherein said buffer member is made of rubber with Shore A hardness greater than or equal to 30 degrees and less than or equal to 40 degrees.

7. The microphone module as claimed in claim 1 , wherein a ratio of a contact area of said buffer member with said mounting seat and a total area of an outer surface of said buffer member is greater than or equal to 0.05 but smaller than 0.2.

8. The microphone module as claimed in claim 2 , wherein said mounting seat further includes a second abutment face connected transversely to said suspension surfaces and said first abutment face and spaced apart from said main body, said buffer member further including a second bump protruding from said main body toward and abutting against said second abutment face.

9. The microphone module as claimed in claim 2 , wherein said buffer member includes a plurality of said first bumps protruding from said main body toward said first abutment face, said main body having a wire passing hole disposed between said first bumps and communicating said accommodating space with an external environment.

10. The microphone module as claimed in claim 4 , wherein said mounting seat further includes a positioning plate disposed between said suspension surfaces opposite to said first abutment face and abutting against one side of said tubular portion, said positioning plate having a positioning groove receiving a portion of said tubular portion.

11. The microphone module as claimed in claim 10 , wherein said positioning plate further has two abutment portions abutting against said main body, said positioning groove being formed between said abutment portions.

12. An electronic device comprising:
a housing including top and bottom walls; and
a microphone module mounted in said housing and including
a mounting seat including two oppositely spaced-apart upright suspension surfaces extending transversely from said top wall,
a buffer member including a main body disposed between and spaced apart from said suspension surfaces, and two suspension bumps protruding from said main body toward and abutting respectively and tightly against said suspension surfaces, said main body having an inner portion defining an accommodating space, and
a microphone body disposed in said accommodating space.

13. The electronic device as claimed in claim 12 , wherein said mounting seat further includes a first abutment face connected between said suspension surfaces and spaced apart from said main body, said buffer member further including at least one first bump protruding from said main body toward and abutting against said first abutment face.

14. The electronic device as claimed in claim 12 , wherein said mounting seat further includes two spaced-apart ribs protruding from said bottom wall and spaced apart from said main body, said buffer member further including an elongated bump protruding from said main body toward and abutting against said ribs.

15. The electronic device as claimed in claim 12 , wherein said buffer member further includes a tubular portion extending from said main body away from said accommodating space, said tubular portion communicating said accommodating space with an external environment and being transverse with an arrangement direction of said suspension bumps.

16. The electronic device as claimed in claim 12 , wherein said main body has an upright flat area on one side thereof, and an inclined area extending oppositely, downwardly, and inclinedly from a bottom end of said flat area.

17. The electronic device as claimed in claim 12 , wherein said buffer member is made of rubber with Shore A hardness greater than or equal to 30 degrees and less than or equal to 40 degrees.

18. The electronic device as claimed in claim 12 , wherein a ratio of a contact area of said buffer member with said mounting seat and a total area of an outer surface of said buffer member is greater than or equal to 0.05 but smaller than 0.2.

19. The electronic device as claimed in claim 12 , wherein said housing and said mounting seat are integrally formed as one piece.

20. The electronic device as claimed in claim 13 , wherein said mounting seat further includes a second abutment face connected transversely to said suspension surfaces and said first abutment face and spaced apart from said main body, said buffer member further including a second bump protruding from said main body toward and abutting against said second abutment face.

21. The electronic device as claimed in claim 13 , wherein said buffer member includes a plurality of said first bumps protruding from said main body toward said first abutment face, said main body having a wire passing hole disposed between said first bumps and communicating said accommodating space with an external environment.

22. The electronic device as claimed in claim 15 , wherein said mounting seat further includes a positioning plate disposed between said suspension surfaces opposite to said first abutment face and abutting against one side of said tubular portion, said positioning plate having a positioning groove receiving a portion of said tubular portion.

23. The electronic device as claimed in claim 22 , wherein said positioning plate further has two abutment portions abutting against said main body said positioning groove being formed between said abutment portions.

Assignees

• Wistron Corp

Inventors

• Lin Cheng-Hsuan
• Chang Kai-Hsiang

Classifications

• H04R1/02 Primary

  Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075}) · CPC title