Image capturing apparatus, control method of image capturing apparatus, device, and control method of device
US-12108145-B2 · Oct 1, 2024 · US
US9520710B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9520710-B2 |
| Application number | US-201414312917-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2014 |
| Priority date | Jun 24, 2014 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A thermal trip assembly for use with a busbar includes a fastener, an insulating sleeve, a temperature sensor structured to sense a temperature of the busbar, and a thermal trip circuit structured to output a trip signal based on the sensed temperature. A portion of the insulating sleeve is disposed between the temperature sensor and the busbar. The fastener couples the insulating sleeve and the temperature sensor to the busbar with the insulating sleeve being in direct contact with a portion of the busbar.
Opening claim text (preview).
What is claimed is: 1. A thermal trip assembly for use with a busbar, the thermal trip assembly comprising: a fastener including a first prong, a second prong, and a central member, wherein the central member is connected to the first prong and the second prong; an insulating sleeve; a temperature sensor structured to sense a temperature of the busbar; and a thermal trip circuit structured to output a trip signal based on the sensed temperature, wherein the fastener is structured to couple the thermal trip assembly to the busbar such that the insulating sleeve, the temperature sensor, and the busbar are disposed between the first prong and the second prong when the thermal trip assembly is coupled to the busbar, wherein a portion of said insulating sleeve is disposed between the temperature sensor and the busbar when the thermal trip assembly is coupled to the busbar; and wherein the insulating sleeve is in direct contact with a portion of the busbar when the thermal trip assembly is coupled to the busbar. 2. The thermal trip assembly of claim 1 , wherein the insulating sleeve is composed of thermal silicone material. 3. The thermal trip assembly of claim 1 , wherein the insulating sleeve has a thermal conductivity within a range of about 1.2 W/mK to about 1.8 W/mK; and wherein the insulating sleeve has a specific heat capacity within a range of about 1.05 kJ/kgK to about 1.3 kJ/kgK. 4. The thermal trip assembly of claim 1 , wherein the temperature sensor is a thermal diode. 5. The thermal trip assembly of claim 1 , wherein the thermal trip assembly further includes an ambient temperature sensor disposed apart from the busbar and structured to sense an ambient temperature; and wherein the thermal trip circuit is structured to output the trip signal based on the sensed temperature of the busbar and the sensed ambient temperature. 6. The thermal trip assembly of claim 5 , wherein the ambient temperature sensor is a thermal diode. 7. The thermal trip assembly of claim 5 , wherein the thermal trip circuit includes: a temperature sensing circuit structured to output a voltage based on the temperature sensed by the temperature sensor; a differential amplifier circuit structured to amplify to an output a difference between the voltage output by the temperature sensing circuit and a first predetermined voltage; a follower circuit structured to buffer to an output a voltage of the output of the differential amplifier circuit; an integrator circuit structured to smooth to an output a voltage of the output of the follower circuit; an ambient temperature sensing circuit structured to output a voltage based on the ambient temperature sensed by the ambient temperature sensor; an ambient differential amplifier circuit structured to amplify to an output a difference between the voltage output by the ambient temperature sensing circuit and a second predetermined voltage; an ambient follower circuit structured to buffer to an output a voltage of the output of the ambient differential amplifier circuit; an ambient integrator circuit structured to smooth to an output a voltage of the output of the ambient follower circuit; an ambient output circuit structured to buffer to an output a voltage of the output of the ambient integrator circuit; and a comparator circuit structured to combine a voltage of the outputs of the integrator circuit and the ambient output circuit, to compare a voltage of the combined outputs of the integrator circuit and the ambient output circuit with a third predetermined voltage, and to output the trip signal when the combined outputs of the integrator circuit and the ambient output circuit are greater than the third predetermined voltage. 8. The thermal trip assembly of claim 1 , wherein the fastener is a metallic clip. 9. The thermal trip assembly of claim 1 , wherein the busbar includes a flat portion; and wherein the insulating sleeve is structured to be in direct contact with the flat portion of the busbar. 10. A thermal trip assembly for use with a busbar, the thermal trip assembly comprising: a fastener; an insulating sleeve; a temperature sensor structured to sense a temperature of the busbar; and a thermal trip circuit structured to output a trip signal based on the sensed temperature, wherein a portion of said insulating sleeve is disposed between the temperature sensor and the busbar; and wherein the fastener couples the insulating sleeve and the temperature sensor to the busbar with the insulating sleeve being in direct contact with a portion of the busbar; and wherein the thermal trip circuit includes: a temperature sensing circuit structured to output a voltage based on the temperature sensed by the temperature sensor; a differential amplifier circuit structured to amplify to an output a difference between the voltage output by the temperature sensing circuit and a first predetermined voltage; a follower circuit structured to buffer to an output a voltage of the output of the differential amplifier circuit; an integrator circuit structured to smooth to an output a voltage of the output of the follower circuit; and a comparator circuit structured to compare a voltage of the output of the integrator circuit with a second predetermined voltage and to output the trip signal when the output of the integrator circuit is greater than the second predetermined voltage. 11. A circuit interrupter comprising: a first terminal; a second terminal; a plurality of busbars electrically connecting the first and second terminals; separable contacts moveable between a closed position and an open position, the first and second terminals being electrically disconnected from each other when the separable contacts are in the open position; an operating mechanism structured to open said separable contacts; an actuator structured to cooperate with said operating mechanism to trip open said separable contacts; a current sensor structured to sense a current flowing between the first and second terminals; a current transformer structured to harvest power from the current flowing between the first and second terminals; and an electronic trip unit including: an other trip function circuit structured to output a first trip signal to control the actuator to cooperate with the operating mechanism to trip open the separable contacts based on the current sensed by the current sensor; and a thermal trip assembly comprising: a fastener including a first prong, a second prong, and a central member, wherein the central member is connected to the first prong and the second prone; an insulating sleeve; a temperature sensor structured to sense a temperature of one of the plurality of busbars; and a thermal trip circuit structured to output a second trip signal based on the sensed temperature, wherein the fastener is structured to couple the thermal trip assembly to the said one of the plurality of busbars such that the insulating sleeve, the temperature sensor, and said one of the plurality of busbars are disposed between the first prong and the second prong when the thermal trip assembly is coupled to said one of the plurality of busbars; wherein a portion of said insulating sleeve is disposed between the temperature sensor and said one of the plurality of busbars when the thermal trip assembly is coupled to said one of the plurality of busbars; and wherein the insulating sleeve is in direct contact with a portion of said one of the plurality of busbars when the thermal trip assembly is coupled to said one of the plurality of busbars. 12. The circuit interrupter of claim 11 , wherein the insulating sleeve is composed of thermal silicone
for reducing thermal inertia · CPC title
using semiconducting elements having PN junctions (G01K7/02, G01K7/16, G01K7/30 take precedence) · CPC title
for measuring surface temperatures · CPC title
using a semiconductor device to sense the temperature · CPC title
additionally responsive to excess current (H02H5/048 takes precedence) · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.