Semiconductor device and method of forming bump-on-lead interconnection
US-9064858-B2 · Jun 23, 2015 · US
Light source including ceramic substrate mounted on mounting substrate
US9520544B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9520544-B2 |
| Application number | US-201514869499-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2015 |
| Priority date | Sep 30, 2014 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
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Abstract
Official abstract text for this publication.
A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.
First claim
Opening claim text (preview).
What is claimed is: 1. A light source comprising: a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having the light emitting element mounted thereon, the ceramic substrate being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. 2. The light source according to claim 1 , further comprising a resin disposed in gaps between the plurality of…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H01L33/62Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9520544B2 cover?
- A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mountin…
- Who is the assignee on this patent?
- Nichia Corp
- What technology area does this patent fall under?
- Primary CPC classification H01L33/62. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).