Semiconductor device structure and method of forming
US-2015200134-A1 · Jul 16, 2015 · US
US9520359B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9520359-B2 |
| Application number | US-201514815752-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 31, 2015 |
| Priority date | Oct 30, 2014 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
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A semiconductor device, which may be included in a display driver integrated circuit (IC) and a display device, includes a first interconnection and a second interconnection extending on a substrate and separate from each other, a third interconnection extending at a first level that is higher than a level at which the first interconnection and the second interconnection are disposed, and a fourth interconnection extending at a second level that is higher than the first level. A first contact plug is configured to connect the first interconnection and the third interconnection to each other. A stacked contact plug includes a second contact plug and a third contact plug, wherein the second contact plug is connected to the second interconnection, and the third contact plug is connected to the second contact plug and the fourth interconnection.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a plurality of first interconnections and a plurality of second interconnections extending on a substrate, the first interconnections and the second interconnections being alternately disposed with respect to each other as viewed in a direction perpendicular to the substrate; a plurality of third interconnections extending along a first planar surface at a first level higher than a level at which the first interconnection…
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