Chip electronic component and board having the same

Patent metadata

Field	Value
Publication number	US-9520239-B2
Application number	US-201514671714-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Oct 15, 2014
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.

First claim

What is claimed is:

1. A chip electronic component comprising:
a ceramic body;
external electrodes provided on both side portions of the ceramic body in a length direction; and
an interposer supporting the ceramic body and electrically connected to the external electrodes,
wherein the interposer includes:
first and second terminal electrodes provided on both side portions thereof in the length direction; and
recesses provided inwardly in the first and second terminal electrodes along the side portions of the interposer in the length direction.

2. The chip electronic component of claim 1 , wherein when a width of each of the external electrodes is We and a length of the ceramic body is L, We/L is 0.20 to 0.89.

3. The chip electronic component of claim 1 , wherein when a length of each of the first and second terminal electrodes is A, a length of each of the recesses is B, a width of each of the first and second terminal electrodes is C, and a width of each of the recesses is D, 0.167≦(B×D)/(A×C)≦0.710 is satisfied.

4. The chip electronic component of claim 1 , wherein the interposer further includes third and fourth terminal electrodes provided on both end portions thereof.

5. The chip electronic component of claim 1 , wherein the ceramic body includes internal electrodes and dielectric layers that are alternately stacked,
the internal electrodes disposed to be parallel to the first and second terminal electrodes.

6. The chip electronic component of claim 4 , wherein the third and fourth terminal electrodes are connected to the first and second terminal electrodes respectively.

Assignees

• Samsung Electro Mech

Inventors

• Park Sang Soo
• Lee Soon Ju
• Ahn Young Ghyu
• Park Heung Kil

Classifications

• H01C7/10

  voltage responsive, i.e. varistors · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H05K2201/10378

  Interposers · CPC title

• H05K2201/2045

  Protection against vibrations · CPC title