Clad metal bus bar for film capacitor and film capacitor comprising the same

Patent metadata

Field	Value
Publication number	US-9520235-B2
Application number	US-201414543691-A
Country	US
Kind code	B2
Filing date	Nov 17, 2014
Priority date	Jun 30, 2014
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

A clad metal bus bar for a film capacitor may include a clad metal layer including: an aluminum layer; a first copper layer stacked on one surface of the aluminum layer; and a second copper layer stacked on the other surface of the aluminum layer.

First claim

What is claimed is:

1. A clad metal bus bar for a film capacitor, comprising a clad metal layer comprising:
an aluminum layer;
a first copper layer stacked on one surface of the aluminum layer; and
a second copper layer stacked on the other surface of the aluminum layer,
wherein the thicknesses of the first and second copper layers are set in the range of about 10% to about 25% of the entire thickness of the clad metal layer, and the thickness of the aluminum layer is set in the range of about 50% to about 70% of the entire thickness of the clad metal layer, and
the clad metal layer has a percentage reduction in thickness of less than about 10% and an elongation percentage of about 25% or more, and the bond strength of the clad metal layer, measured on the basis of ISO 11339, is equal to or higher than about 10 kgf or more, based on a specimen width of 25 mm.

2. The clad metal bus bar of claim 1 , wherein the thickness ratio of the first copper layer to the second copper layer is set in the range of about 1:0.5 to about 1:1.5.

3. The clad metal bus bar of claim 1 , wherein the thicknesses of the first and second copper layers are set in the range of about 15% to about 25% of the entire thickness of the clad metal layer, and the cross-sectional thickness of the aluminum layer is set in the range of about 50% to about 65% of the entire thickness of the clad metal layer.

4. The clad metal bus bar of claim 1 , wherein the thickness ratio of the first or second copper layer to the aluminum layer is set in the range of about 1:3 to about 1:8.

5. The clad metal bus bar of claim 1 , wherein the first and second copper layers have a thickness of about 0.05 mm to about 0.5 mm, and the aluminum layer has a thickness of about 0.3 mm to about 2.0 mm.

6. The clad metal bus bar of claim 1 , wherein the clad metal bus bar has a thickness of about 0.5 mm to about 2.5 mm.

7. The clad metal bus bar of claim 1 , wherein the ratio of the percentage reduction in thickness to the elongation percentage of the clad metal layer is set in the range of about 1:2 to about 1:15.

8. The clad metal bus bar of claim 1 , wherein the clad metal bus bar has an electrical conductivity of about 60 IACS % or more.

9. The clad metal bus bar of claim 1 , wherein the clad metal layer has an elongation percentage of about 25% to about 35%.

10. A film capacitor comprising the clad metal bus bar of claim 1 .

Assignees

• Hyundai Mobis Co Ltd

Inventors

• Hwang Deuk Kyu
• Chun Yong
• Lee Kee Yang

Classifications

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G2/04 Primary

  specially adapted for mounting on a chassis · CPC title

• H01G4/33

  Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

• H01G4/32

  Wound capacitors · CPC title

• H05K7/02

  Arrangements of circuit components or wiring on supporting structure · CPC title