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Microscopic roughness structure with protective film and method thereof
US9519082B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9519082-B2 |
| Application number | US-201214238053-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 16, 2012 |
| Priority date | Aug 16, 2011 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
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Abstract
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In a protective film affixed to a microscopic roughness structure having a microscopically rough structure on the surface, water contact angle of the surface of the microscopic roughness structure is 40° or less, compressive stress obtainable when the adhesive layer of the protective film is compressed to a compression ratio of 20% is 0.6 MPa to 3.0 MPa; in the infrared absorption spectrum of the surface on the microscopically rough structure side of the microscopic roughness structure, ratio (A1/A2) of peak area A1 having absorption maximum of 3700 cm −1 to 3100 cm −1 , and peak area A2 having absorption maximum of 1730±10 cm −1 , is 0.1 to 0.8; in the surface of adhesive layer of the protective film, ratio (B1/B2) of peak area B1 having absorption maximum of 3700 cm −1 to 3100 cm −1 , and peak area B2 having absorption maximum of 1730±10 cm −1 , is 0.6 to 1.3.
First claim
Opening claim text (preview).
The invention claimed is: 1. A protective film-attached microscopic roughness structure comprising: a microscopic roughness structure on the surface having a microscopically rough structure having a period less than or equal to the wavelength of visible light, and a protective film for protecting the surface of the microscopic roughness structure affixed thereto, wherein the water contact angle of the surface of the microscopic roughness structure is 40° or less, the protectiv…
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Physics · mapped topic
Physics · mapped topic
- G02B1/14Primary
Physics · mapped topic
Cross-Sectional Technologies · mapped topic
Cross-Sectional Technologies · mapped topic
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- What does patent US9519082B2 cover?
- In a protective film affixed to a microscopic roughness structure having a microscopically rough structure on the surface, water contact angle of the surface of the microscopic roughness structure is 40° or less, compressive stress obtainable when the adhesive layer of the protective film is compressed to a compression ratio of 20% is 0.6 MPa to 3.0 MPa; in the infrared absorption spectrum of t…
- Who is the assignee on this patent?
- Takihara Tsuyoshi, Mori Seiichiro, Okamoto Eiko, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification G02B1/14. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).