Probe card for probing integrated circuits
US-9207259-B2 · Dec 8, 2015 · US
Integrated high-speed probe system
US9519010B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9519010-B2 |
| Application number | US-201414506146-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 3, 2014 |
| Priority date | Apr 28, 2011 |
| Publication date | Dec 13, 2016 |
| Grant date | Dec 13, 2016 |
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Abstract
Official abstract text for this publication.
An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
First claim
Opening claim text (preview).
What is claimed is: 1. An integrated high-speed probe system for transmitting a grounding voltage level, a first testing signal, and a second testing signal from a tester for testing a device under test (DUT), the first testing signal having a first frequency different from a second frequency of the second testing signal, the integrated high-speed probe system comprising: a circuit substrate being divided into a probe area and a testing area from a center of the circuit substrate…
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Cross-Sectional Technologies · mapped topic
Physics · mapped topic
Physics · mapped topic
Electricity · mapped topic
- G01R1/06772Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9519010B2 cover?
- An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of t…
- Who is the assignee on this patent?
- Mpi Corp
- What technology area does this patent fall under?
- Primary CPC classification G01R1/06772. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).