Acoustic sensor apparatus

US9518849B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9518849-B2
Application numberUS-201514928543-A
CountryUS
Kind codeB2
Filing dateOct 30, 2015
Priority dateJan 20, 2015
Publication dateDec 13, 2016
Grant dateDec 13, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or the cap unit to a medium.

First claim

Opening claim text (preview).

What is claimed is: 1. An acoustic sensor apparatus comprising: a sensor unit configured to process an input acoustic signal; and a housing comprising: a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit configured to mechanically couple the body unit or the cap unit to a medium, wherein one surface of the sensor unit is spaced apart from the accommodation groove and a vibration space in which air vibrates by vibration of the housing is formed in the vicinity of the sensor unit. 2. The acoustic sensor apparatus according to claim 1 , wherein the coupling unit comprises any one of a bolt, a screw, and a rivet. 3. The acoustic sensor apparatus according to claim 2 , wherein the coupling unit is configured to mechanically couple a first medium to a second medium. 4. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal the vibration space is formed in a vicinity of the input unit. 5. The acoustic sensor apparatus according to claim 1 , further comprising: a connection unit configured to electrically couple the sensor unit to an external part. 6. The acoustic sensor apparatus according to claim 5 , wherein one side of the connection unit is electrically coupled to the sensor unit and other side thereof is exposed to outside of the housing. 7. The acoustic sensor apparatus according to claim 6 , wherein the sensor unit further comprises: an input unit configured to receive an acoustic signal; a circuit unit configured to process an output signal of the input unit; and a substrate, one surface of which is connected to the input unit, the circuit unit, and the connection unit, wherein one surface of the substrate is spaced apart from the cap unit, and the vibration space is formed in a vicinity of the input unit. 8. The acoustic sensor apparatus according to claim 6 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal, and the vibration space formed in a vicinity of the input unit, the housing comprising an air introduction hole through which the vibration space communicates with an external part, and the connection unit being exposed to outside through the air introduction hole. 9. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit further comprises: an input unit configured to receive an acoustic signal; a circuit unit configured to process an output signal of the input unit; and a substrate, one surface of which is connected to the input unit and the circuit unit and another surface of which is electrically coupled to an external part. 10. The acoustic sensor apparatus according to claim 9 , wherein one surface of the substrate is spaced apart from the accommodation groove, and the vibration space is formed in a vicinity of the input unit. 11. The acoustic sensor apparatus according to claim 10 , wherein the substrate is seated on the bottom surface of the accommodation groove. 12. The acoustic sensor apparatus according to claim 1 , wherein the sensor unit comprises an input unit configured to receive an acoustic signal, and the vibration space formed in a vicinity of the input unit; and the housing includes an air introduction hole through which the vibration space communicates with an external part. 13. An acoustic sensor apparatus, comprising: a sensor unit configured to process an acoustic signal; a housing comprising a housing portion and a coupling portion configured to connect the housing portion to a medium, an inner surface of the housing portion forming an opening configured to accommodate the sensor unit; and a cap unit configured to close the opening, wherein a part of the inner surface of the housing portion is spaced apart from the sensor unit or the cap unit, forming a vibration space in which air vibrates by vibration of the housing, and the vibration space formed in the vicinity of the sensor unit. 14. The acoustic sensor apparatus according to claim 13 , wherein the sensor unit comprises: an input unit configured to receive the acoustic signal; a circuit unit configured to process an output signal of the input unit; and a substrate connected to the input unit, the circuit unit, the substrate electrically coupled to an external part. 15. An acoustic sensor apparatus comprising: a sensor unit configured to process an input acoustic signal; and a housing comprising: a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit configured to mechanically couple the body unit or the cap unit to a medium, wherein the sensor unit further comprises: an input unit configured to receive an acoustic signal, a circuit unit configured to process an output signal of the input unit, and a substrate, one surface of which is connected to the input unit and the circuit unit and another surface of which is electrically coupled to an external part, wherein one surface of the substrate is spaced apart from the accommodation groove, and a vibration space in which air vibrates by vibration of the housing is formed in a vicinity of the input unit, wherein the substrate is seated on a bottom surface of the accommodation groove, a connection unit electrically coupled to the sensor unit comprises a space concaved inward at one surface contacting the substrate, and at least one of the input unit or the circuit unit is accommodated in the concaved space of the connection unit. 16. The acoustic sensor apparatus according to claim 15 , wherein the housing comprises an air introduction hole through which the vibration space communicates with an external part. 17. The acoustic sensor apparatus according to claim 16 , wherein the connection unit is exposed to outside through the air introduction hole.

Assignees

Inventors

Classifications

  • Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the other groups of this subclass · CPC title

  • G01D11/245Primary

    Housings for sensors · CPC title

  • G01H11/00Primary

    Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties · CPC title

  • providing acoustic coupling {, e.g. water (impedance matching G10K11/02)} · CPC title

  • using acoustic emission techniques {(echo of particles G01N29/046; measuring mechanical vibrations or acoustic waves in solids in general G01H1/00)} · CPC title

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What does patent US9518849B2 cover?
An acoustic sensor apparatus mounted to a medium is disclosed. The acoustic sensor apparatus includes: a sensor unit processing an input acoustic signal; and a housing including a body unit having an accommodation groove in which the sensor unit is accommodated, a cap unit formed to close an opening of the accommodation groove, and a coupling unit formed to mechanically couple the body unit or …
Who is the assignee on this patent?
Hyundai Motor Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01D11/245. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 13 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).