System and method for automated backing film removal

Patent metadata

Field	Value
Publication number	US-9517615-B2
Application number	US-201514691923-A
Country	US
Kind code	B2
Filing date	Apr 21, 2015
Priority date	Apr 21, 2015
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

A backing film removal system including a substrate support member configured to support a substrate, where a backing film is attached to the substrate, a backing film separating member arranged operatively with respect to the substrate support member such that at least a portion of the backing film separating member is positionable between at least one portion of the substrate and backing film when the substrate is disposed on the substrate support member, a backing film holding member configured to maintain a separation between the substrate and backing film at the at least one portion of the substrate and backing film, and at least one drive unit connected to one or more of the substrate support member and the backing film separating member and operable to cause relative movement between the substrate support member and the backing film separating member.

First claim

What is claimed is:

1. A backing film removal system comprising:
a substrate support member configured to support a substrate, where a backing film is attached to the substrate;
a backing film separating member arranged operatively with respect to the substrate support member such that at least a portion of the backing film separating member is positionable between at least one portion of the substrate and backing film when the substrate is disposed on the substrate support member;
a backing film holding member configured to maintain a separation between the substrate and backing film at the at least one portion of the substrate and backing film;
at least one drive unit connected to one or more of the substrate support member and the backing film separating member and operable to cause relative movement between the substrate support member and the backing film separating member; and
a transport device to which the backing film separating member is mounted, the transport device being configured to move the hacking film separating member along a predetermined path between the backing film and substrate to effect separation of the backing film from the substrate;
wherein the backing film separating member is rotatably coupled to the transport device where the transport device drives the hacking film separating member both rotationally and linearly relative to the substrate support member.

2. The backing film removal system of claim 1 , wherein the backing film separating member comprises a wire.

3. The backing film removal system of claim 1 , wherein the backing film separating member comprises a monofilament wire.

4. The backing film removal system of claim 1 , wherein the backing film separating member is arranged at a crossing angle relative to a direction of relative movement between the backing film separating member and the substrate support member.

5. The backing film removal system of claim 1 , further comprising an automated robot, the substrate support member comprising an end-effector coupled to the automated robot.

6. The backing film removal system of claim 1 , wherein the backing film holding member is configured to maintain a separation between the backing film and the substrate at a pre-separated portion of the substrate to effect positioning of the backing film separating member between the at least one portion of the substrate and backing film.

7. The backing film removal system of claim 1 , further comprising a backing film collection unit configured to receive the backing film upon separation of the backing film from the substrate.

8. A method for removing a backing film from a substrate, the backing film attached to the substrate along at least a portion of the substrate, the method comprising:
positioning a backing film separating member between the backing film and the substrate at a first location; and
moving the backing film separating member relative to the substrate so that the backing film separating member is passed between the backing film and the substrate from the first location along a length of the substrate to separate the backing film from the substrate;
wherein moving the backing film separating member relative to the substrate includes moving the backing film separating member in a first direction relative to the substrate and in a second direction angled to or opposite the first direction, and moving the backing film separating member relative to the substrate includes moving the backing film separating member linearly and rotationally relative to the substrate.

Assignees

• Boeing Co

Inventors

• Dong Shuonan
• Taylor Joseph

Classifications

• Y10T156/1978

  Delaminating bending means · CPC title

• B32B2313/04

  Carbon · CPC title

• B32B38/10

  Removing layers, or parts of layers, mechanically or chemically · CPC title

• B26D2001/008

  in the form of wires · CPC title

• B32B2305/28

  in the form of a mat · CPC title