Polishing apparatus and polishing method

Patent metadata

Field	Value
Publication number	US-9517544-B2
Application number	US-201414577101-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Dec 3, 2007
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

First claim

What is claimed is:

1. A polishing method comprising:
rotating a substrate by a rotary holding mechanism;
polishing a first region in a periphery of the substrate by pressing a polishing tape against the first region;
polishing a second region in the periphery of the substrate by pressing the polishing tape against the second region;
during said polishing of the second region, cleaning the first region by pressing a cleaning cloth against the first region; and
after said polishing of the second region, cleaning the second region by pressing the cleaning cloth against the second region.

2. The polishing method according to claim 1 , wherein the polishing tape is pressed against the first region and the second region at different angles.

3. The polishing method according to claim 1 , wherein:
the first region is a lower slope of the periphery of the substrate; and
the second region is an edge surface of the periphery of the substrate.

4. A polishing method comprising:
rotating a substrate by a rotary holding mechanism;
polishing a periphery of the substrate by pressing a polishing tape against the periphery of the substrate; and
during said polishing, supplying a cooling liquid having a temperature of at most 10° C. to both the periphery of the substrate and the polishing tape simultaneously, thereby removing a frictional heat from a contact portion between the substrate and the polishing tape.

5. The polishing method according to claim 4 , wherein the polishing tape comprises abrasive grains and a resin.

6. A polishing method comprising:
rotating a substrate by a rotary holding mechanism;
supplying a liquid onto the rotating substrate;
during said supplying of the liquid onto the rotating substrate, pressing a polishing tape by a first polishing head against a periphery of the substrate so as to polish the periphery; and
during said supplying of the liquid onto the rotating substrate, keeping a second polishing head, that does not perform polishing, away from the substrate such that the liquid does not bounce back to the substrate.

7. The polishing method according to claim 6 , wherein a distance between the substrate and the second polishing head is determined based on a rotational speed of the substrate.

8. A polishing method comprising:
rotating a substrate by a rotary holding mechanism;
supplying a liquid onto the rotating substrate;
during said supplying of the liquid onto the rotating substrate, pressing a polishing tape by a first polishing head against a periphery of the substrate so as to polish the periphery; and
during said supplying of the liquid onto the rotating substrate, keeping a second polishing head, that does not perform polishing, inclined at such an angle that the liquid does not bounce back to the substrate.

9. The polishing method according to claim 8 , wherein the angle of the second polishing head is determined based on a rotational speed of the substrate.

10. The polishing method according to claim 8 , further comprising:
moving the second polishing head toward the rotating substrate while keeping the angle thereof; and
causing the second polishing head to press a polishing tape against the periphery of the substrate.

Assignees

• Ebara Corp

Inventors

• Takahashi Tamami
• Seki Masaya
• Kusa Hiroaki
• Yamaguchi Kenji
• Nakanishi Masayuki

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• Y10T428/24777

  Edge feature · CPC title

• B24B49/00

  Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation (B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence) · CPC title

• B24B41/068

  Table-like supports for panels, sheets or the like · CPC title

• B24B37/042

  operating processes therefor · CPC title