Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board

Patent metadata

Field	Value
Publication number	US-9516748-B2
Application number	US-201314407074-A
Country	US
Kind code	B2
Filing date	Jun 14, 2013
Priority date	Jun 14, 2012
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board.

First claim

The invention claimed is:

1. A circuit board, comprising
a base and
an electric-conducting layer,
wherein the base has a first region and a second region on one side thereof facing the electric-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities,
wherein the second region is configured to be flat, and
wherein the first insulating layer and the second insulating layer are fixedly connected through a solder.

2. The circuit board according to claim 1 ,
wherein that the first insulating layer has a higher thermal conductivity than the second insulating layer.

3. The circuit board according to claim 1 , wherein the base is made from a metal.

4. The circuit board according to claim 3 , wherein the first insulating layer is a ceramic insulating layer.

5. The circuit board according to claim 4 , wherein the second insulating layer is a polymer insulating layer.

6. The circuit board according to claim 3 , wherein a joint layer is formed between an inner wall of the first region and the first insulating layer for fixedly connecting the base and the first insulating layer.

7. The circuit board according to claim 6 , wherein the joint layer comprises solder pads formed on the inner wall and on an outer wall of the first insulating layer facing the inner wall and a solder joining the solder pads.

8. The circuit board according to claim 3 , wherein the base is made from a material selected from aluminum, aluminum alloy and copper.

9. The circuit board according to claim 1 , wherein surfaces of the first insulating layer and the second insulating layer are on the same horizontal plane.

10. The circuit board according to claim 1 , wherein the electric-conducting layer is configured as a printed circuit layer.

11. The circuit board according to claim 1 , wherein the electric-conducting layer comprises a first electric-conducting layer formed on the first insulating layer and a second electric-conducting layer formed on the second insulating layer.

12. The circuit board according to claim 11 , wherein the first and second electric-insulating layers are spaced from each other and connected through wires, and any two of the first and second electric-insulating layers are spaced from each other.

13. The circuit board according to claim 12 , wherein the first electric-conducting layer comprises at least two electric-adjoining regions and a heat-adjoining region, wherein any two of the at least two electric-adjoining regions and the heat-adjoining region are spaced from each other.

Assignees

• Osram Gmbh

Inventors

• Yang Jianghui
• Zhong Chuanpeng
• Li Hao
• Chen Xiaomian

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H01L2924/00014

  Electricity · mapped topic

• H05K2201/09745

  Recess in conductor, e.g. in pad or in metallic substrate · CPC title