Open earphone
US-2024422466-A1 · Dec 19, 2024 · US
US9516415B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9516415-B2 |
| Application number | US-201114357930-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 9, 2011 |
| Priority date | Dec 9, 2011 |
| Publication date | Dec 6, 2016 |
| Grant date | Dec 6, 2016 |
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A double backplate microphone having a good signal-to-noise ratio and being produceable at reduced manufacturing costs is provided. A microphone comprises a first backplate BP 1 , a second backplate BP 2 and a membrane M. The microphone further comprises an amplifier AMP with a single-ended input port. The first backplate BP 1 is electrically connected to the single-ended input port.
Opening claim text (preview).
The invention claimed is: 1. A double backplate microphone, comprising a micro-electro-mechanical system (MEMS) chip, an amplifier with an single-ended input port, a first backplate, electrically connected to the single-ended input port, a second backplate electrically connected to ground, a membrane, arranged between the first and the second backplate, a first resistive element having a resistance >=1 GΩ and electrically connected to the first backplate, a second resistive element having a resistance >=1 GΩ and electrically connected to the membrane, a first capacitance C 1 between the first backplate and the membrane, a second capacitance C 2 between the second backplate and the membrane, a parasitic capacitance Cp 1 between the first backplate and ground, a parasitic capacitance Cm between the membrane and ground, a parasitic capacitance CP 2 between the second backplate and ground, where 4 pF<=Cm=C 1 =C 2 <=8 pF, Cp 1 =0.1*C 1 , Cp 2 =0.5*C 1 , the first backplate, the membrane, and the second backplate are arranged on the MEMS-chip. 2. The double backplate microphone of claim 1 , where the first backplate is biased with a voltage between −2 V and +2 V. 3. The double backplate microphone of claim 1 , where the membrane is biased with a voltage V 1 relative to the first backplate, the membrane is biased with a voltage V 2 relative to the second backplate, and 5 V<=V 1 =V 2 <=15 V. 4. The double backplate microphone of claim 1 , where the amplifier is a low noise amplifier. 5. The double backplate microphone of claim 1 , further comprising a carrier substrate and a IC-chip, where the amplifier comprises amplifier circuits arranged in the IC-chip, the MEMS-Chip and the IC-chip are arranged on the carrier substrate. 6. The double backplate microphone of claim 1 , further comprising a MEMS-chip, where the first backplate, the membrane, and the second backplate are arranged on the MEMS-chip, the amplifier comprises amplifier circuits arranged in the MEMS-chip. 7. The double backplate microphone of claim 1 , where the first resistive element and the second resistive element are realized as surface-mounted device (SMD) components. 8. The double backplate microphone of claim 1 , where the first resistive element and the second resistive element are realized in an IC chip.
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