Radiating sub-terahertz signal from tapered metallic waveguide into dielectric waveguide

Patent metadata

Field	Value
Publication number	US-9515367-B2
Application number	US-201514939128-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Mar 19, 2013
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A metallic waveguide is mounted on a multilayer substrate. The metallic waveguide has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate. A pinnacle of the tapered end is coupled to the ground plane element, and the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

First claim

What is claimed is:

1. A process of operating an electronic device comprising:
generating a sub-terahertz signal in an integrated circuit within the electronic device;
transporting the sub-terahertz signal to a tapered metallic waveguide located on a multilayer substrate of the electronic device; and
radiating a portion of the sub-terahertz signal from the tapered metallic waveguide into a dielectric waveguide.

2. The process of claim 1 in which the transporting includes transporting the sub-terahertz signal on a microstrip line formed in one of the layers of the multilayer substrate parallel to a ground plane element that is located in another one of the layers of the multilayer substrate.

3. The process of claim 2 , in which the radiating includes radiating the sub-terahertz signal into a metallic waveguide that has an open end formed by a top, bottom and sides configured to receive a core member of a dielectric waveguide, and an opposite tapered end formed by declining the top of the metallic waveguide past the bottom of the metallic waveguide and down to contact the multilayer substrate, in which a pinnacle of the tapered end is coupled to the ground plane element, and in which the bottom side of the metallic waveguide is in contact with the multiplayer substrate and coupled to the microstrip line.

4. The process of claim 3 including linearly increasing the width of the microstrip line from a point proximate where a pinnacle of the tapered metallic waveguide is coupled to a ground plane to a width approximately equal to a width of the metallic waveguide at point where the microstrip line is coupled to the metallic waveguide.

Assignees

• Texas Instruments Inc

Inventors

• Herbsommer Juan Alejandro
• Payne Robert Floyd
• Schuppener Gerd
• Haroun Baher

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W44/248

  for antennas · CPC title

• G02B6/4416

  Heterogeneous cables · CPC title