Molding packaging material and battery case

US9515299B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9515299-B2
Application numberUS-201214007652-A
CountryUS
Kind codeB2
Filing dateMar 29, 2012
Priority dateMar 29, 2011
Publication dateDec 6, 2016
Grant dateDec 6, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat resistant resin; an inside sealant layer ( 3 ) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer ( 4 ). A matte coat layer ( 6 ) comprising a heat resistant resin coating film containing a dispersion of inorganic or organic solid microparticles is formed on the outer surface of the outside substrate layer ( 2 ), and the gloss value of the surface thereof is suppressed to no greater than 30%.

First claim

Opening claim text (preview).

The invention claimed is: 1. A molding packaging material, comprising: an outside substrate layer containing a heat-resistant resin; an inside sealant layer containing a thermoplastic resin; and a metallic foil as a barrier layer provided between the layers; wherein a matte coat layer containing a heat-resistant resin composition containing a dispersion of inorganic and/or organic solid fine particles is formed by coating on an outside surface of the outside substrate layer, and a gloss value of a surface on a side of the matte coat layer is 1% to 30%; wherein the heat-resistant resin composition of the matte coat layer includes a dispersion of inorganic and/or organic solid fine particles having an average particle diameter of 1 μm to 10 μm. 2. A molding packaging material, comprising: an outside substrate layer containing a heat-resistant resin; an inside sealant layer containing a thermoplastic resin; and a metallic foil as a barrier layer provided between the layers, wherein at least an inside surface of the metallic foil layer is subjected to chemical conversion treatment, an inside adhesion resin layer having adhesiveness to both the metallic foil as the barrier layer and the resin of the inside sealant layer is laminated on the chemical conversion-treated surface, the inside sealant layer is further laminated through the adhesion resin layer, the outside substrate layer contains a biaxially oriented polyamide resin film, a matte coat layer containing a resin composition containing a dispersion of inorganic and/or organic solid fine particles in a heat-resistant resin component is formed by coating on an outside surface of the outside substrate layer, and a gloss value of a surface on a side of the matte coat layer is 1% to 30%; wherein the heat-resistant resin composition of the matte coat layer includes a dispersion of inorganic and/or organic solid fine particles having an average particle diameter of 1 μm to 10 μm. 3. The molding packaging material according to claim 1 , wherein the gloss value is 1% to 15%. 4. The molding packaging material according to claim 1 , wherein the heat-resistant resin includes fluorine added to a skeleton of a main agent as a main component. 5. The molding packaging material according to claim 4 , wherein the heat-resistant resin composition of the matte coat layer contains a two component curing type heat-resistant resin containing a copolymer of tetrafluoroolefin and carboxylic acid vinyl ester as a main component. 6. The molding packaging material according to claim 5 , wherein the heat-resistant resin composition of the matte coat layer further contains a urethane resin and/or an acrylic resin. 7. The molding packaging material according to claim 1 , wherein the heat-resistant resin composition of the matte coat layer includes a heat-resistant resin component including 0.1 to 60 wt % of the dispersion of the inorganic and/or organic solid fine particles. 8. The molding packaging material according to claim 1 , wherein the inside sealant layer contains a propylene homopolymer or a copolymer containing at least propylene and ethylene as a copolymerization component. 9. The molding packaging material according to claim 8 , wherein the inside sealant layer is the polymer or the copolymer having a melting point of 130° C. to 160° C. and an MFR of 1 to 25 g/10 min. 10. The molding packaging material according to claim 2 , wherein the inside adhesion resin layer contains an adhesive containing a polyolefin resin having a carboxyl group and a multifunctional isocyanate compound. 11. The molding packaging material according to claim 10 , wherein an equivalent ratio [NCO]/[OH] of an isocyanate group of the multifunctional isocyanate compound to a hydroxyl group constituting the carboxyl group of the polyolefin resin is 1.0 to 10.0. 12. The molding packaging material according to claim 10 , wherein, in the polyolefin resin having a carboxyl group, a melt flow rate (MFR) measured at 130° C. is 5 to 40 g/10 min. 13. A battery case, which is obtained by performing deep draw forming or bulging of the molding packaging material according to claim 1 . 14. The molding packaging material according to claim 1 , which is used as a packaging material for foods or pharmaceuticals.

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What does patent US9515299B2 cover?
Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and can have superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer ( 2 ) comprising a heat resistant resin; an inside sealant layer ( 3 ) comprising…
Who is the assignee on this patent?
Kuramoto Tetsunobu, MINAMIBORI Yuuji, Showa Denko Packaging Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B7/12. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).